Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating, and Heat Resistant Epoxy Compound for High Performance Bonding and Sealing. Serviceable from 4K to 400°F. Meets NASA Low Outgassing.
Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance. Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.