Two Component High Performance Epoxy Resin System Featuring High Thermal Stability, Excellent Thermal Conductivity, Superior Electrical Insulation Properties and Outstanding Dimensional Stability for Coating, Sealing, Potting and Encapsulation Applications. Serviceable Up to 450°-500°F
Two Component, Room Temperature Curing Epoxy Adhesive, Sealant & Coating Featuring a Convenient One to One Mix Ratio, Exceptionally High Thermal Conductivity and Excellent Electrical Insulation Properties.
Two Component, Room Temperature Curing Epoxy Adhesive, Sealant and Coating Featuring Exceptional Thermal Conductivity, Excellent Electrical Insulation Properties and High Temperature Resistance.
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive for Bonding, Sealing, Coating and Encapsulating Featuring a Convenient and Forgiving 1:1 Mix Ratio.
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive, Sealant and Coating Featuring a 1:1 Mix Ratio and High Temperature Resistance Up To 400°F
Two Component Heat Resistant Epoxy Adhesive, Sealant, Encapsulant With High Thermal Conductivity, and Excellent Dimensional Stability Up to 400°F Service
Two Part, Room Temperature Curing Epoxy System Offers Thermal Conductivity and Electrical Insulation for Potting & Encapsulation as well as Bonding, Sealing and Coating; Has a Forgiving One to One Mix Ratio.
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating, and Heat Resistant Epoxy Compound for High Performance Bonding and Sealing. Serviceable from 4K to 400°F. Meets NASA Low Outgassing.
