Heat Sink Attachment
Heat sinks are often used in electronic and optoelectronic devices to cool components, ensuring a longer product lifespan and improved performance. Typical heat sink applications include:
- Computers
- Graphic processors
- LEDs
- High powered lasers
- Printed circuit boards
In order for a heat sink to function properly and dissipate heat, it must be precisely attached to the component. Master Bond epoxies are ideal for this process and offer many required properties, such as:
- Outstanding thermal conductivity
- Superior gap filling capabilities
- Enhanced shock, impact and vibration resistance
- Exceptional electrical insulation properties
- Thermal stability
- Excellent mechanical strength
