Nanotechnology Formulated Adhesives, Sealants and Coatings
Nanotechnology has made important contributions to the formulation of adhesives, sealants, coatings, potting and encapsulation compounds. Nanoparticle fillers such as bentonites, nano-sized silica particles and zeolites has lead to the development of products with enhanced:

  • Thermal stability
  • Water/chemical resistance
  • Transparency
  • Thermal conductivity
  • Tensile strength

Applications Featuring Master Bond’s Nanotechnology Adhesives

Master Bond is at the forefront of technologically advanced adhesive solutions formulated for high quality performance. Our compounds are featured in a variety of applications including:

  • Potting of sensors
  • Sealing of electrical modules
  • Adhesive functioning as a thermally conductive medium for semiconductor packaging or other heat prone applications
  • Absorption of external vibrations and impact in high precision devices