Polymer Systems for Nanotechnology Applications
Nanotechnology has made important contributions to the formulation of adhesives, sealants, coatings, potting and encapsulation compounds. Nanoparticle fillers such as bentonites, nano-sized silica particles and zeolites has lead to the development of products with enhanced:
- Thermal stability
- Water/chemical resistance
- Transparency
- Thermal conductivity
- Tensile strength
Applications Featuring Master Bond’s Nanotechnology Adhesives
Master Bond is at the forefront of technologically advanced adhesive solutions formulated for high quality performance. Our compounds are featured in a variety of applications including:
- Potting of sensors
- Sealing of electrical modules
- Adhesive functioning as a thermally conductive medium for semiconductor packaging or other heat prone applications
- Absorption of external vibrations and impact in high precision devices
