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Polymer Systems for Nanotechnology Applications

Nanotechnology Formulated Adhesives, Sealants and Coatings
Nanotechnology has made important contributions to the formulation of adhesives, sealants, coatings, potting and encapsulation compounds. Nanoparticle fillers such as bentonites, nano-sized silica particles and zeolites has lead to the development of products with enhanced:

  • Thermal stability
  • Water/chemical resistance
  • Transparency
  • Thermal conductivity
  • Tensile strength

Applications Featuring Master Bond’s Nanotechnology Adhesives

Master Bond is at the forefront of technologically advanced adhesive solutions formulated for high quality performance. Our compounds are featured in a variety of applications including:

  • Potting of sensors
  • Sealing of electrical modules
  • Adhesive functioning as a thermally conductive medium for semiconductor packaging or other heat prone applications
  • Absorption of external vibrations and impact in high precision devices

LATEST PRODUCT

Well suited for bonding dissimilar substrates, Master Bond UV15X-2 is a one part UV curable adhesive...

LATEST WHITE PAPER

Engineers often want to know whether an adhesive is low outgassing or generic. And while there are cases when nothing but...