Polymer Systems for Nanotechnology Applications

Nanotechnology Formulated Adhesives, Sealants and Coatings
Nanotechnology has made important contributions to the formulation of adhesives, sealants, coatings, potting and encapsulation compounds. Nanoparticle fillers such as bentonites, nano-sized silica particles and zeolites has lead to the development of products with enhanced:

  • Thermal stability
  • Water/chemical resistance
  • Transparency
  • Thermal conductivity
  • Tensile strength

Applications Featuring Master Bond’s Nanotechnology Adhesives

Master Bond is at the forefront of technologically advanced adhesive solutions formulated for high quality performance. Our compounds are featured in a variety of applications including:

  • Potting of sensors
  • Sealing of electrical modules
  • Adhesive functioning as a thermally conductive medium for semiconductor packaging or other heat prone applications
  • Absorption of external vibrations and impact in high precision devices

LATEST PRODUCT

Specially formulated to optimize bond strength, Master Bond UV15-42C is a UV curable system for...

LATEST WHITE PAPER

The use and selection process of thermally conductive epoxies can make or break your application. Too much heat can lead...