 
Experts In Solving Problems
 |
Master
Bond's technical team has over 30 years of experience
and understands the unique needs of each and every
application. We provide personal “one-on-one” assistance
and can recommend a compound tailor-made to meet your
requirements. Put our expertise to work for you. Contact
us today. |
 |
Adhesives,
Sealants, Coatings and
Potting & Encapsulation Compounds for the Electronics
Industry
Master Bond
formulates the widest
selection of epoxies, silicones, polyurethanes, polysulfides,
cyanoacrylates and UV cures to meet your needs. Specific Master
Bond grades offer:
 High
bond strength to similar and dissimilar substrates- Thermal and electrical conductivity
- Superior electrical insulation properties
- Low stress
- Low outgassing
- Dimensional stability
- Low coefficients of thermal expansion
- High and low temperature serviceability
- Resistance to water and a wide range of chemicals
- Fast cures at ambient temperatures or slightly elevated temperatures
- Withstand exposure to vibration, impact and shock
- Exceptional durability
- Easy repairability
We have the technical expertise to solve your problems. Contact
our world class technical staff today,
and let them recommend a Master Bond product specifically for
your application.
Most Popular Products
| |
Product |
Description |
Silver
Conductive |
EP21TDC/S |
Two part, room temperature curing,
silver conductive epoxy with a service temperature range
of 4K to 275°F. Excellent mechanical properties and high
sheer and peel strength. One to one mix
ratio and low volume resistivity <10-3 ohm-cm. |
Underfill
Potting |
EP3RR-1
|
This potting and underfill one
part heat cured epoxy features a fast cure,
as well as good heat resistance. Additionally,
this product is thermally conductive, castable to 1 inch
thick, and serviceable from -60º to 400ºF. |
Thermal
Conductive |
EP30AN-1 |
Two part, room temperature curing
epoxy with good electrical insulation properties. Used
primarily in potting and bonding. Low viscosity
and good flow properties. Meets NASA low outgassing
specifications and exhibits exceptional thermal conduction
properties |
Chemical
Resistant |
EP41S-1 |
Two part, room temperature curing
epoxy widely used as a bonding, coating, and potting
epoxy where excellent solvent resistance is needed. Exhibits
good flow properties and excellent bonding characteristics. |
Low
Outgassing |
SUPREME
10HT/S |
One part, heat cured system (125-150°C)
with excellent electrical conductivity and physical
properties. Widely
used for die attach and chip bonding. Outstanding
bonding and thermal cycling capabilities. |
| Silicone |
MASTERSIL 713 |
One part, room temperature curing
RTV. Rapid setting with excellent flexibility,
very low viscosity, and outstanding temperature resistance. Additionally,
exhibits resistance to moisture, and is often used as
a compound coating with remarkable repairability. |
| Shielding |
AC85
|
Acrylic based, silver conductive, one
part system for EMI/RFI shielding. Surface resistivity <0.01-0.03
(ohm²). |
Products by Type &
Use
Packaged the Way You Need
It
 |
|
We offer a wide array of packaging
options to speed productivity, minimize waste and save energy
including...
• Quantities from grams to gallons
• Cans, bottles
and jars
• Cartridges for manual and pneumatic guns
• Premixed and frozen
syringes
• Bipaks for field service kits
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|
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Die attach adhesive for chip stacking BGA, high thermal
BGA, LED, and smart card application
Sensor device/OEM Implantation
RFID and smart card assembly
