New Highly Flexible Silver Conductive Epoxy Adhesive
Release Date: 10/05/2007
Master Bond EP21TDCSFL is a new two component, room temperature curing, silver filled, epoxy adhesive developed by Master Bond Inc., Hackensack, N.J. It exhibits high flexibility and has an elongation of >60%. EP21TDCSFL is easy to use and has a 1 to 1 mix ratio by weight or volume. It cures at room temperatures or more rapidly at elevated temperatures. It can be applied on vertical surfaces with minimal sagging. This compound is 100% reactive and does not contain any diluents or solvents.
EP21TDCSFL has a volume resistivity of <10-3 ohm cm. It offers mechanical shock resistance and low outgassing properties. Adhesion to metals, glass, ceramics, rubbers and many plastics is excellent. It has a service operating temperature range of from 4K to +250°F. Additionally EP21TDCSFL is particularly recommended for bonding dissimilar substrates that are being thermally cycled and shocked. It has inherently low shrinkage which enables the cured system to exert very little mechanical stress on sensitive components and substrates.
EP21TDCSFL has a tensile shear strength of >1,500 psi and a T-peel of >30 pli. It has a thermal conductivity of 11 BTU/in/ft²/hr/°F. Highly flexible, EP21TDCSFL is well suited for repair applications. Parts A and B are both colored silver.
Master Bond EP21TDCSFL is available for use in half-pint, pint, quart and gallon container kits. It also is available in premixed and frozen syringes.
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