Master Bond EP17HTS-DA is a new one component, no mix, die attach epoxy that is electrically conductive and withstands high temperatures.
It is a silver filled system. Typically, glass transition temperature (Tg) declines with the addition of a filler like silver.
Master Bond EP21TPHT is a new two component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable
bonds resistant to chemicals. It resists temperatures up to 350°F, much higher than typical epoxy polysulfide systems.
Master Bond EP30DPBFMed is a two part, flexibilized epoxy-urethane hybrid system that can be used for bonding, sealing, coating, and encapsulation.
It is formulated for disposable and reusable medical devices, meeting USP Class VI requirements while also complying with RoHS3 in accordance
Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications.
It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive
Master Bond EP62-1AO is a two part epoxy adhesive and sealant with an exceptionally long working life of 12-14 hours at ambient temperature for a 100 gram mass.
This makes it beneficial when bonding and sealing large or intricate parts that may need ample time for mixing and applying.
Master Bond Supreme 121AO is a NASA low outgassing approved epoxy suitable for bonding, sealing and potting applications.
Featuring a high glass transition temperature of 200-210°C, it resists temperatures up to 550°F.
This system exhibits an element of toughness, and is not as stiff as conventional epoxies that withstand extreme temperatures.