Master Bond Inc. manufactures an extensive line of adhesives, sealants, conformal coatings, potting & encapsulation compounds and other specialty systems designed to meet the diverse needs of the microelectronics industry. Master Bond offers specialty systems for computers, telecommunications devices, audio/video devices, avionics and aerospace applications, as well as automotive manufacturing, interactive circuitry and advanced semiconductor equipment.

Our line of microelectronic formulations consists of epoxies, silicones, polyurethanes, acrylics and latex options. They include electrically insulative, thermally conductive and electrically conductive systems. Both one and two component compounds are available for use. These products are currently employed in applications ranging from heat sinking to glob tops to surface mounting. Many of our compounds have unique properties such as low thermal expansion coefficients, exceptionally high thermal conductivity, low stress, etc. Master Bond is also actively engaged in developing new products to keep pace with the rapid technological advances in microelectronics ranging from flip-chip technology to advanced die-attach processes.

Our products are manufactured under the strictest quality control standards and are tailor made to provide solutions to specific needs. For ease of use, Master Bond products are available in convenient applicators in various size units. Particularly noteworthy are our premixed and frozen syringe systems for two component epoxy adhesives. Additionally, for unusual applications, we offer custom made formulations.

Master Bond provides prompt personalized "one-on-one" technical assistance and will be glad to answer any questions you may have. We have over three decades of experience in solving technical problems.

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