MASTER BOND ONE COMPONENT SERIES APPLICATION SELECTOR GUIDE
Select One Component Epoxy Adhesives, Sealants, Coatings, Encapsulants & Potting Compounds
Partial Listing Only –— Other Grades Available
|
|
Viscosity |
|
Storage Stability, RT |
Cure Schedule |
Service Temp Range, °F |
|
|
| EP3FL |
60,000-70,000 |
yellow to |
3 months@75°F |
5-10 min @ 300°F |
4°K to 250°F |
Flexible adhesive, sealant and encapsulant. Good electrical properties. Outstanding thermal cycling and thermal shock resistance. Cryogenically serviceable. |
|
| EP3HT |
>250,000 |
yellow to |
6 months |
5-10 min @ 300°F |
-60 to 400°F |
Rapid curing, heat resistant, general purpose adhesive/sealant. Superior physical and electrical properties. Ideal for manufacturing applications. Bonds well to a broad range of substrates. |
|
| EP3HTFL |
>150,000 |
yellow to |
3 months@75°F |
5-10 min @ 300°F |
-100 to 350°F |
Flexibilized version of EP3HT for bonding, sealing & potting. Enhanced thermal shock resistance. Good electrical properties. |
|
| EP3HTMED |
>200,000 |
tan or |
6 months |
5-10 min @ 300°F |
-60 to 400°F |
Fast curing, Class VI approved adhesive, sealant & encapsulant. Excellent physical strength profile. Resists various types of sterilization, particularly cold sterilants. |
|
| EP3RR-1 |
120,000-150,000 |
light yellow |
3 months@75°F 6 months@40°F |
5-10 min @ 300°F |
-60 to 400°F |
Toughened system featuring rapid curing, good thermal conductivity & heat resistance. Excellent flowability. Primarily for potting & underfill applications. Castable over 1 inch thick. |
|
| EP3SP5FL |
80,000-90,000 |
yellow to |
6 weeks |
1 min @ 300°F |
-60 to 250°F |
“Snap” cure version of EP3FL. Fastest curing system available. Ideal for high speed manufacturing & production. Good physical properties. Bonds well to most substrates. |
|
| EP11HT |
150,000-160,000 |
tan |
6 months |
60-90 min @ 300°F |
-60 to 400°F |
High temperature resistant structural adhesive. Good thermal & dimensional stability. High tensile shear strength. |
|
| EP13 |
paste |
gray |
6 months |
60-90 min @ 300-350°F |
-60 to 450°F |
High performance structural adhesive. Outstanding temperature resistance up to 450°F. Non-drip application feature. Very high compressive strength. Readily machinable. |
|
| EP15 |
90,000-100,000 |
tan |
3 months |
60-90 min @ 300-350°F |
-60 to 250°F |
Very high tensile strength (>12,000 psi) system for testing adhesion or cohesive strength of flame-sprayed coatings as per ASTM specification C 633-69. |
|
| EP19HT |
600 |
amber |
4 months |
45 min @ 300°F |
-60 to 400°F |
Low viscosity impregnant, sealant, coating and laminating epoxy. Good mechanical & electrical insulation properties. Frequently used to impregnate graphite and for transformer steel laminations. |
|
| EP36 |
semi-solid |
tan |
6 months |
melts at 180°F, cures at 250-300°F
for 90-120 minutes, uncured |
-100 to 500°F |
Unique B stage type epoxy system. Combines superb temperature resistance with high flexibility & elongation. Superior dielectrics. Exceptional thermal cycling properties. Passes Class H thermal insulation requirements. Good flowability. Excellent potting epoxy. |
|
| EP36AO |
semi-solid |
light tan |
6 months |
melts at 180°F, cures at 250-300°F
for 90-120 minutes, uncured |
-100 to 500°F |
Thermally conductive version of EP36. Semi-flexible. For potting and encapsulation. Good heat transfer properties. Suitable for moderate size castings. Good mechanical and thermal shock resistance. Passes Class H thermal insulation tests. |
|
| EP101HTX-3 |
1,000-1,500 |
clear with fluorescent |
6 weeks |
2-6 hrs @ 250°F followed by |
-60 to 500°F |
Very low viscosity, impregnant, coating and encapsulation epoxy. Excellent dielectric properties. Very low dissipation factor. Exceptionally high temperature resistance. |
|
| FL901AO |
film |
gray |
6 months@40°F |
1 hr @ 250°F |
-100 to 400°F |
Thermally conductive film adhesive/sealant. Standard size is 2” x 6” x 3 mils thick. Other sizes and die/laser cuts available. |
|
| FL901S |
film |
silver |
6 months@40°F |
1 hr @ 250°F |
-100 to 400°F |
Electrically conductive film adhesive/sealant. Low resistance. Standard size is 2” x 6” x 3 mils thick. Other sizes and die/laser cuts available. |
|
| Supreme 3HT |
120,000-135,000 |
yellow to |
6 months |
5-10 min @ 300°F |
-100 to 350°F |
Toughened version of EP3HT. Exceptionally well suited for bonding dissimilar substrates. Excellent mechanical and thermal shock resistance. Good thermal cycling properties. |
|
| Supreme 3AOHT |
paste |
off-white to |
6 months |
5-10 min @ 300°F |
-100 to 350°F |
Thermally conductive adhesive/sealant. Good mechanical and electrical insulation properties. Rapid curing. Well suited for bonding substrates with different coefficients of expansion. |
|
| Supreme 3HTND-1SM |
thixotropic paste |
light yellow |
6 months |
5-10 min @ 300°F |
-60 to 350°F |
Rapid curing, high strength surface mount adhesive. Low ionic impurities. Supplied in syringes for convenient manual or automatic dispensing. “No tailing” application feature. |
|
| Supreme 3HTND-2GT |
thixotropic paste |
light yellow |
6 months |
5-10 min @ 300°F |
-60 to 350°F |
High performance glob top offering superb protection for circuitry and components including fragile ones. Low ionic impurities. Convenient syringe packaging for manual or automatic dispensing. |
|
| Supreme 10HT |
>250,000 |
gray |
6 months |
45 min @ 300°F |
4°K to 400°F |
High performance adhesive/sealant. Ultra high bond strength (shear & peel), NASA low outgassing approved. Cryogenically serviceable. Outstanding toughness and durability. |
|
| Supreme 10HTF |
>250,000 |
gray |
3 months@40°F |
5-10 min @ 300°F |
4°K to 400°F |
“Snap cure” version of Supreme 10HT with similar physical and electrical properties. Cures in 2 minutes at 375°F. Also available in nickel and silver filled versions. |
|
| Supreme 10AOHT |
paste |
light gray |
6 months |
45 min @ 300°F |
-100 to 400°F |
Thermally conductive version of Supreme 10HT (about 10 BTU•in/ft2•hr•°F). Good electrical insulation properties. Excellent dimensional stability and toughness. |
|
| Supreme 10ANHT |
paste |
gray |
6 months |
45 min @ 300°F |
-100 to 400°F |
High thermally conductive version of Supreme 10HT (>22 BTU•in/ft2•hr•°F). Superior physical and electrical properties. |
|
| Supreme 10HT-1 |
120,000-140,000 |
gray |
6 months |
45 min @ 300°F |
4°K to 400°F |
Special toughened version of Supreme 10HT. Enhanced thermal cyclability, mechanical & thermal shock resistance. Excellent physical strength properties. Cryogenically serviceable. |
|
| Supreme 10HTLVCL |
30,000-40,000 |
amber |
6 months |
45 min @ 300°F |
-100 to 400°F |
Lower viscosity version of Supreme 10HT. Good flowability. Serviceable as an adhesive, sealant or encapsulant. |
|
| Supreme 10HTN |
paste |
nickel gray |
3 months |
45 min @ 300°F |
-100 to 400°F |
Nickel filled version of Supreme 10HT with 5-10 ohm-cm resistance. Superior physical strength properties and chemical resistance. For bonding, sealing and shielding. |
|
| Supreme 10HTND-2 |
paste |
gray |
6 months |
45 min @ 300°F |
-100 to 400°F |
Paste version of Supreme 10HT. Non-drip application feature. Will not flow when heat cured. |
|
| Supreme 10HTS |
paste |
silver |
3 months |
45 min @ 300°F |
4°K to 400°F |
Silver filled version of Supreme 10HT. Very low resistance (<1 milliohm). Passes NASA low outgassing tests. Cryogenically serviceable. Exceptionally high shear & peel strength. |
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Master Bond Inc.
Adhesives, Sealants & Coatings • 154 Hobart Street • Hackensack, N.J. 07601 • Tel: 201-343-8983 • Fax: 201-343-2132
Notice: Master Bond believes the information on the data sheets is reliable and accurate as is technical advice provided by the company. Master Bond makes no warranties (expressed or implied) regarding the accuracy of the information and assumes no liability regarding the handling and usage of this product. C259