MASTER BOND ELECTRICALLY CONDUCTIVE PRODUCT SELECTOR GUIDE
Selected Adhesives, Sealants & Coatings Specially Formulated for Electronic Applications
Partial Listing Only –— Other Grades Available
Two Component Epoxies —
|
|
|
Mixed Viscosity |
|
|
|
|
Volume Resistivity |
|
| EP21TDCN |
100/100 |
paste |
45-60 |
24-48 hrs @ RT |
-100 to +275°F |
nickel |
5-10 |
Excellent general purpose nickel filled adhesive/sealant. High shear & peel strength. Convenient handling. |
| EP21TDCNFL |
100/100 |
paste |
60-75 |
24-48 hrs @ RT |
4°K to +250°F |
nickel |
5-10 |
High flexibility version of EP21TDCN. High peel strength. Good shock & vibration resistance. Cryogenically servicable. |
| EP21TDCS |
100/100 |
paste |
30-40 |
24-36 hrs @ RT |
4°K to +275°F |
silver |
<10-3 |
High performance adhesive/sealant. Convenient handling, excellent physical strength properties. High peel and shear strength. Widely used in microelectronics. |
| EP21TDCSFL |
100/100 |
paste |
45-60 |
24-48 hrs @ RT |
4°K to +250°F |
silver |
<10-3 |
Unique formulation, high flexibility version of EP21TDCS, exceptionally high elongation. Very high peel strength. Cryogenic serviceability. Easily repairable. |
| EP21TDCS MED |
100/100 |
smooth paste |
25-30 |
24 hrs @ RT |
4°K to +250°F |
silver |
<10-3 |
Class VI approved medical grade formulation. Excellent physical properties. Widely used in medical electronics. |
| EP30C |
100/5 |
paste |
20-30 |
24 hrs @ RT |
-60 to +300°F |
nickel |
5-10 |
Special nickel filled system featuring excellent shear strength and superior chemical resistance. |
| EP51N |
100/100 |
paste |
5-10 |
8-12 hrs @ RT |
-60 to +250°F |
nickel |
5-10 |
Fast setting nickel filled adhesive/sealant. Adheres well to a wide variety of substrates. Good durability. |
| EP75-1 |
100/15 |
paste |
60 |
24-48 hrs @ RT |
-60 to +250°F |
graphite |
50-100 |
General purpose graphite filled system. Cost effective adhesive/sealant and coating for EMI / RFI type applications. Utilized when non-metallic filler is required. |
| EP76M |
100/100 |
paste |
45-60 |
24-48 hrs @ RT |
-60 to +250°F |
nickel |
5-10 |
Easy to use, 1:1 system. Excellent adhesive/sealant. Superior physical and mechanical strength properties. |
| EP76MHT |
100/100 |
paste |
45-60 |
24-48 hrs @ RT |
-60 to +400°F |
nickel |
5-10 |
High temperature resistant version of EP76M. Serviceable to 400°F. Convenient processing. |
| EP76M-F |
100/100 |
paste |
4-6 |
6-10 hrs @ RT |
-60 to +250°F |
nickel |
5-10 |
Slightly faster setting version of EP51N. Convenient 1 to 1 mix ratio. Well suited for manufacturing. |
| EP77M-1 |
100/8 |
paste |
20-30 |
24 hrs @ RT |
-60 to +250°F |
silver |
<10-3 |
Silver filled adhesive/sealant for mil spec applications. High shear strength. Enhanced chemical resistance. |
| EP77M-F |
100/100 |
paste |
5-10 |
4-6 hrs @ RT |
-60 to +250°F |
silver |
<10-3 |
Fast setting, silver filled system. Convenient handling. Particularly useful in manufacturing, circuit board repair and other applications where rapid tack is required . |
| EP78 |
100/100 |
paste |
30-45 |
24-48 hrs @ RT |
-60 to +250°F |
silver coated microspheres |
<0.5 |
Cost effective, low resistance adhesive/sealant system. Bonds well to a large number of substrates. |
| EP79 |
100/100 |
paste |
45-60 |
24-48 hrs @ RT |
4°K to +275°F |
silver coated nickel |
<0.04 |
Low resistance, cost effective alternative to silver filled systems. Excellent physical properties. |
| EP80 |
100/100 |
paste |
45-60 |
24-48 hrs @ RT |
4°K to +275°F |
silver coated copper |
<0.02 |
A second cost effective alternative to silver. Slightly lower resistance than EP79. |
One Component Epoxies —
| Master Bond Grade |
Viscosity |
|
Cure Schedule |
|
Service Temp Range, °F |
Vol. Resistivity |
|
| Supreme 10HTN |
paste |
3 months |
1 hr @ 250°F |
nickel |
-100 to +400°F |
5-10 |
Superior adhesive/sealant. Good physical strength properties. Excellent for thermal cycling. High temperature serviceability |
| Supreme 10HTS |
paste |
3 months |
1 hr @ 250°F |
silver |
4°K to +400°F |
<10-3 |
High performance adhesive/sealant. NASA approved for low outgassing. Excellent shear & peel strength. Cryogenically serviceable. Widely used in microelectronics. Can withstand up to 400°F. Screen printable |
| Supreme 10HTFN |
paste |
3 months in |
5-10 min @ 300°F |
nickel |
-100 to +400°F |
5-10 |
“Snap curing” version of Supreme 10HTN. Cost effective. For high volume manufacturing or production. Requires refrigeration. |
| Supreme 10HTFS |
paste |
3 months in |
5-10 min @ 300°F |
silver |
4°K to +400°F |
<10-3 |
“Snap curing” version of Supreme 10HTS. Widely used in manufacturing, surface mount applications & repair situations. Cryogenically serviceable. Excellent physical strength properties. Requires refrigeration. |
| FL901S |
film |
6 months |
1 hr @ 250°F |
silver |
-100 to +400°F |
<0.0002 |
High performance film adhesive/sealant. Exceptionally convenient handling. Low resistance. Standard size is 2” x 6” x 3 mils thick. Other sizes and die cuts available. |
Miscellaneous —
| Master Bond
|
Type of |
|
|
Cure Schedule |
Viscosity |
Service Temp Range, °F |
|
Surface Resistivity (ohm²) |
|
| AC82 |
acrylic |
solvent evaporation |
3 months |
2-4 hrs @ RT |
flowable |
-60 to +300°F |
nickel |
1-3 |
Reliable EMI / RFI shielding for metals, plastics and ceramics. Shielding effectiveness >60 dB. |
| AC83 |
acrylic |
solvent evaporation |
3 months |
2-4 hrs @ RT |
paste |
-60 to +300°F |
graphite |
10-25 |
Low cost EMI / RFI shielding for metals, plastics and ceramics. Shielding effectiveness >40 dB. |
| AC84 |
acrylic |
solvent evaporation |
3 months |
2-4 hrs @ RT |
thixotropic |
-60 to +300°F |
copper |
0.05-0.08 |
Highly effective EMI / RFI shielding for use in controlled atmospheres. Shielding effectiveness >70 dB. |
| AC85 |
acrylic |
solvent evaporation |
3 months |
2-4 hrs @ RT |
paste |
-60 to +300°F |
silver |
<0.01-0.03 |
Maximum EMI / RFI shielding effectiveness for metals, plastics and ceramics. Shielding effectiveness >75 dB. |
| X5G |
rubber |
solvent evaporation |
3 months |
2-4 hrs @ RT |
flowable |
-80 to +250°F |
graphite |
10-25 |
Low cost adhesive, sealant and coating. Good bond strength and chemical resistance. Cures flexible. Shielding effectiveness >40dB. |
| X5N |
rubber |
solvent evaporation |
3 months |
2-4 hrs @ RT |
flowable |
-80 to +250°F |
nickel |
0.08-2 |
Versatile high performance adhesive/sealant . High strength bonds to most substrates. Flexible coating system with shielding effectiveness of >60dB. |
| X5SC |
rubber |
solvent evaporation |
3 months |
2-4 hrs @ RT |
paste |
-80 to +250°F |
silver |
<0.01-0.03 |
Highest performance rubber based adhesive/sealant. Excellent peel strength and durability. Cures as a flexible coating with shielding effectiveness of >75dB. |
| LTX117G |
latex |
water |
6 months |
4-6 hrs @ RT |
paste |
-60 to +250°F |
graphite |
15-25 |
Low cost water-based adhesive, sealant and coating. Shielding effectiveness as a coating is >40dB. |
| LTX117N |
latex |
water |
6 months |
4-6 hrs @ RT |
flowable |
-60 to +250°F |
nickel |
2-4 |
High strength water-based adhesive, sealant & coating with shielding effectiveness >60dB. |
Master Bond Inc.
Adhesives, Sealants & Coatings • 154 Hobart Street • Hackensack, N.J. 07601 • Tel: 201-343-8983 • Fax: 201-343-2132
Notice: Master Bond believes the information on the data sheets is reliable and accurate as is technical advice provided by the company. Master Bond makes no warranties (expressed or implied) regarding the accuracy of the information and assumes no liability regarding the handling and usage of this product. D239