EP21HT

100/100

“A” clear
“B” amber

50,000-60,000

50-70

24-48 hrs @ RT
2 hrs @ 200°F

-60 to +400°F

General purpose type sealant, adhesive & encapsulant.  Convenient handling & easy processing.  Meets food grade specifications.  Superior electrical insulator.  Also available in a non-drip version called EP21HTND.

EP21AOHT

100/100

“A” gray
“B” off white

paste

60-80

24-48 hrs @ RT
1-2 hrs @ 200°F

-60 to +400°F

Thermally conductive/electrically insulative.  For bonding & sealing.  Superior bond strength & dimensional stability.  Adheres well to metals, plastics, glass & ceramics.

EP21ANHT

100/100

“A” light gray
“B” light gray

paste

60-80

24-48 hrs @ RT
1-2 hrs @ 200°F

-60 to +400°F

High thermally conductive version of EP21AOHT.  Thermal conductivity > 22 BTU•in/ft²•hr•°F.

EP21TCHT-1

100/60

“A” off white
“B” off white

light
paste

30-35

18-24 hrs @ RT
1-2 hrs @ 200°F

4°K to +400°F

Thermally conductive/electrically insulative.  NASA approved for low outgassing.  For bonding, sealing and encapsulating.  Low coefficient of expansion.

EP21TDCHT

100/100

“A” clear
“B” amber

100,000-120,000

60-90

48 hrs @ RT
2-3 hrs @ 200°F

-100 to +350°F

Toughened system.  Combines convenient handling with superior mechanical &  thermal shock resistance.  Also has excellent thermal cycling properties.  Well suited for bonding & sealing dissimilar substrates.

EP30HT

100/25

“A” clear
“B” clear

35,000-45,000

25-35

24 hrs @ RT
1-2 hrs @ 200°F

-60 to +400°F

Transparent system.  Widely used in optical and electro-optic applications.  For bonding, sealing, coating and potting.  Superb physical strength, chemical resistance and electrical insulation properties.

EP30AOHT

100/10

“A” off white
“B” clear

70,000-80,000

30-35

24-36 hrs @ RT
1-2 hrs @ 200°F

-60 to +400°F

Thermally conductive, electrically insulative version of EP30HT.  Good flowability.  Widely used for potting and encapsulation.  Superior dimensional stability.

EP30ANHT

100/10

“A” light gray
“B” clear

70,000-80,000

30-35

24-36 hrs @ RT
1-2 hrs @ 200°F

-60 to +400°F

High thermally conductive version of EP30AOHT.  Thermal conductivity >22 BTU•in/ft²•hr•°F.  Possesses   low coefficient of expansion.

EP30-3

100/33

“A” clear
“B” clear

5,000-6,000

12-18 hrs

30-45 min @ 160°F
plus 2-3 hrs @ 300°F

-60 to +435°F

Transparent, low viscosity system for bonding, sealing and encapsulation. High light transmission properties.  Superb chemical resistance. Widely used in optical and electro-optic applications.  Requires heat cure.

EP33

100/70

“A” gray
“B” amber

50,000-60,000

50-60

24-48 hrs @ RT
1-2 hrs @ 200°F

-60 to +450°F

Superb adhesive/sealant.  Can resist high radiation levels.  Good physical strength properties and superior dimensional stability.  Readily machinable.

EP34

100/70

“A” black
“B” amber

70,000-80,000

50-60

24-48 hrs @ RT
1-2 hrs @ 200°F

-60 to +450°F

Mineral filled version of EP33.  Superior electrical insulation properties.  Exceptionally high tensile strength.

EP34CA

100/50

“A” black
“B” brown

5,000-6,000

12-24 hrs

1 hr @ 150°F plus
2-3 hrs @ 300°F

-60 to +500°F

Low viscosity structural adhesive.  Also used for encapsulation, filament winding and sealing.  Widely used in high temperature electronic and geophysical applications.  Requires heat cure.

EP35

100/70

“A” gray
“B” amber

70,000-80,000

50-60

24-48 hrs @ RT
1-2 hrs @ 200°F

-60 to +450°F

Specially filled version of EP33.  Enhanced dimensional stability.  High compressive strength.

EP39MHT

100/100

“A” clear
“B” amber

2,000-3,000

90-100

24-48 hrs @ RT
1-2 hrs @ 200°F

-80 to +450°F

Toughened, very low viscosity adhesive, sealant and encapsulant.  Outstanding thermal cycling properties as well as thermal and mechanical shock resistance.  Superior chemical resistance profile. 

EP42HT

100/40

“A” clear
“B” amber

8,000-10,000

35-45

24-36 hrs @ RT
2-3 hrs @ 150°F

-60 to +435°F

Widely used for medical device & repair applications.  USP Class VI approved.  For bonding, sealing, coating & potting.  Resists repeated chemical, ETO, radiation & steam sterilization.  Also available in black (Class VI).

EP45HT

100/30

“A” clear
“B” brown

40,000-50,000

12-24 hrs

1 hr @ 150°F plus
2-3 hrs @ 300°F

-80 to +500°F

High performance adhesive, sealant and  encapsulant.  Marvelous temperature and chemical resistance. Available in a non-drip version called EP45HTND-2.  Meets MMM-A-132 type III.  Requires heat cure.

EP51HT

100/100

“A” clear
“B” tan

60,000-70,000

5 min

4-6 hrs @ RT

-60 to +350°F

Easy to use, higher heat resistant version of EP51
“5 minute” type epoxy.  Easily processable.

EP65HT-1

100/10

“A” clear
“B” dark purple

60,000-70,000

3-5

20-30 min @ RT

-60 to +400°F

Ultra-fast curing, heat resistance epoxy.  Features high bond strength to a wide variety of substrates.  NASA low outgassing approved.  Available in a convenient manual dispensing gun system.

EP76MHT

100/100

“A” gray
“B” gray

paste

45-60

24-48 hrs @ RT
2 hrs @ 200°F

-60 to +400°F

Easy to use, electrically conductive adhesive/sealant.  Nickel filled.  Volume resistance 5-10 ohm-cm.

EP112

100/80

“A” clear
“B” clear

300-400

>24 hrs

2-3 hrs @ 200°F plus 6-10 hrs @ 300°F

-60 to 500°F

Extraordinary electrical insulation properties.  Clear, very low viscosity sealant, encapsulant & impregnant.  Superb non-yellowing properties.  Requires heat cure.

EP121CL

100/80

“A” clear
“B” clear

2,000-3,000

>24 hrs

2-3 hrs @ 200°F
plus 6-8 hrs @ 300°F

-60 to 500°F

Low viscosity potting, sealing and impregnation system.  Very low dielectric constant and dissipation factor. Excellent optical clarity.  Requires heat cure.

EP121AO

100/80

“A” white
“B” white

35,000-45,000

12-24 hrs

3 hrs @ 200°F plus 8-10 hrs @ 300°F

-60 to 500°F

Thermally conductive, electrically isolating version of EP121CL.  Low viscosity and good flowability.  For potting, casting & encapsulation.   Requires heat cure.

EP125

100/50

“A” gray
“B” yellow powder

paste

not applicable

1 hr @ 180°F plus
1 hr @ 300°F plus
2 hrs @ 400°F

-60 to 600°F

Super-high temperature resistant system.  Capable of resisting 600°F service temperatures.  Unsurpassed chemical resistance.  Requires heat cure.

Supreme 11HT

100/100

“A” gray
“B” tan

125,000-135,000

20-30

18-24 hrs @ RT
30-45 min @ 200°F

-100 to +400°F

Easily processable, toughened adhesive/sealant.  Excellent thermal cycling properties.  Superior thermal shock & mechanical impact resistance.  Bonds well to a wide variety of substrates, particularly metals.

Supreme 11AOHT

100/100

“A” gray
“B” white

paste

25-50

24-36 hrs @ RT

1 hr @ 200°F

-100 to +400°F

Thermally conductive version of Supreme 11HT.
Convenient 1 to 1 mix ratio.  Good electrical insulation properties.  Superior resistance to thermal cycling with substrates that have differing coefficients of expansion.

Supreme 11ANHT

100/100

“A” gray
“B” white

paste

25-50

24-36 hrs @ RT

1 hr @ 200°F

-100 to +400°F

High thermally conductive version of Supreme 11AOHT (thermal conductivity exceeds 22 BTU•in/ft²•hr•°F).
Convenient 1 to 1 mix ratio.  Good electrical insulation properties.  Bonds well to dissimilar substrates. 

Supreme 45HT

100/30

“A” tan
“B” brown

65,000-75,000

12-24 hrs

1 hr @ 150°F plus
2-3 hrs @ 300°F

-80 to +450°F

Toughened version of EP45HT.  Bonds well to dissimilar substrates.  Excellent thermal cycling properties and mechanical shock resistance.   Also available in a paste version, Supreme 45HTND-2.  Requires heat cure.

Supreme 45HTQ

100/30

“A” tan
“B” brown

100,000-120,000

12-24 hrs

1 hr @ 150°F plus 3-4 hrs @ 300°F

-80 to +450°F

Structural adhesive and potting system.  Mineral filled version of Supreme 45HT.  Enhanced dimensional stability.  Requires heat cure.

SteelMaster 43HT

100/20

“A” dark gray
“B” tan

thixotropic
paste

20-30

24 hrs @ RT
1-2 hrs @ 200°F

-60 to +400°F

Stainless steel filled system.  Excels at repairing and rebuilding metallic parts.  Also outstanding for bonding carbide to steel.  Superb machinability.  Ultra-high compressive strength.

EP3HT

>250,000

yellow to
brown

6 months

20-30 min @ 250°F
 5-10 min @ 300°F

-60 to 400°F

Fast curing general purpose type adhesive/sealant.  Outstanding mechanical and electrical properties.  Good durability.  Ideal for varied manufacturing applications. 

EP3HTFL

>150,000

yellow to
 amber

3 months@75°F
6 months@40°F

20-30 min @ 250°F
5-10 min @ 300°F

-100 to 350°F

Flexibilized version of EP3HT.  For bonding, sealing,  potting & encapsulating.  Superior thermal & mechanical shock resistance. Withstands severe thermal cycling.  Good electrical properties.

EP3RR-1

120,000-150,000

light yellow

3 months@75°F  6 months@40°F

20-30 min @ 220-230°F
5-10 min @ 300°F

-60 to 400°F

For potting & underfill applications.  Excellent toughness along with good thermal conductivity and heat resistance.  Unique feature of being castable over 1 inch thick.

EP11HT

150,000-160,000

tan

6 months

90-120 min @ 250°F
60-90 min @ 300°F

-60 to 400°F

High temperature resistant structural adhesive.  Good thermal and dimensional stability.  High tensile shear strength.

EP13

paste

gray

6 months

60-90 min @ 300-350°F

-60 to 450°F

High performance structural adhesive. Exceptional physical properties especially compressive strength.  Good dimensional stability.  Readily machinable.  No-drip application feature.

EP19HT

600

amber
clear

4 months

60 min @ 250°F
45 min @ 300°F

-60 to 400°F

Low viscosity impregnant, coating and laminating epoxy with good mechanical and electrical insulation properties.  Frequently used to impregnate graphite and for transformer steel laminations.

EP36

semi-solid

tan

6 months

melts at 180°F, cures at 250-300°F for 90-120 minutes, uncured
material reusable

-100 to 500°F

B stage epoxy system.  Primarily for potting.  Offers a unique combination of superb heat resistance with high flexibility and elongation.  Excellent flowability.  Good dielectrics.  Exceptional thermal cycling properties.  Passes Class H insulation specs.

EP36AO

semi-solid

light tan

6 months

melts at 180°F, cures at 250-300°F for 90-120 minutes, uncured
material reusable

-100 to 500°F

Thermally conductive version of EP36.  Semi-flexible system.  Primarily for potting & encapsulation.  Superior thermal cycling properties.  Good mechanical & thermal shock resistance.   Suitable for moderate size castings.  Passes Class H insulation tests. 

EP101HTX-3

1,000-1,500

clear with fluorescent
dye

6 weeks

2-6 hrs @ 250°F followed by
6-10 hrs @ 300°F

-60 to 500°F

High heat resistant impregnant, coating and encapsulant.  Exceptionally low viscosity.  Combines excellent electrical properties with good physical strength characteristics.

Supreme 3HT

120,000-135,000

yellow to
brown

6 months

20-30 min @ 250°F
 5-10 min @ 300°F

-100 to 350°F

Flexibilized version of  EP3HT.  Fast curing.  Superior mechanical and thermal shock resistance.  Well suited for bonding dissimilar substrates.  Can withstand rigorous thermal cycling.

Supreme 3AOHT

paste

off-white to
light yellow

6 months

20-30 min @ 250°F
5-10 min @ 300°F

-100 to 350°F

Fast curing, thermally conductive, electrically insulative version of Supreme 3HT.  Good thermal cycling properties.  Bonds well to a wide variety of substrates.

Supreme 10HT

>250,000

gray

6 months

60 min @ 250°F
45 min @ 300°F

4°K to 400°F

Versatile, high performance adhesive/sealant.  Superior physical strength properties, especially shear & peel strengths. Cryogenically serviceable.  Passes NASA low outgassing for vacuum compatibility.  Superb thermal cycling & shock characteristics.

Supreme 10AOHT

paste

light gray

6 months

60 min @ 250°F
45 min @ 300°F

-100 to 400°F

Thermally conductive, electrically insulating version of Supreme 10HT.  Good heat transfer properties (>10 BTU•in/ft²•hr•°F).  Superior toughness and durability.  Very well suited for bonding  dissimilar substrates including metals, plastics and ceramics.

Supreme 10ANHT

paste

light gray

6 months

60 min @ 250°F
45 min @ 300°F

-100 to 400°F

High thermally conductive version of Supreme 10AOHT (>22 BTU•in/ft²•hr•°F).  Outstanding for attaching heat sinks.  Well suited for bonding substrates with different coefficients of expansion.

Supreme 10HTN

paste

nickel gray

3 months

60 min @ 250°F
45 min @ 300°F

-100 to 400°F

Nickel filled version of Supreme 10HT for bonding, sealing and shielding.  Volume resistance of 5-10 ohm-cm.  Superior bonding and physical strength properties.  Exceptional thermal cycling characteristics and impact resistance.

Supreme 10HTS

paste

silver

3 months

60 min @ 250°F
45 min @ 300°F

4°K to 400°F

Very low volume resistivity (<0.001 ohm-cm), silver filled version of Supreme 10HT.  Widely used in electronics such as die attach and other circuit board applications.  Serviceable at cryogenic temperatures.  NASA low outgassing approved.