MASTER BOND LOW OUTGASSING APPLICATION SELECTOR GUIDE
For Aerospace, Microelectronic, Optical and Industrial Applications
Master Bond Inc. has developed various “low outgassing” epoxy resin based adhesive systems to meet the maximum 1% TML and maximum 0.1% CVCM acceptability criteria as outlined in ASTM E595. These adhesives comprise both two and one component compositions requiring either ambient or elevated temperature cures as specified below. These “low outgassing” epoxy adhesive compounds are manufactured with exceptionally high quality standards in order to assure reproducible high performance even under the most demanding service conditions. It should be noted that all systems should be fully cured prior to any low outgassing-application.
| Two Component Epoxies — |
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|
|
Mix Ratio |
|
Mixed Viscosity |
Set-Up Time
|
Cure Schedule |
Service Temp Range, °F |
|
| EP21LV |
100/100 |
“A” clear |
6,000-8,000 |
60-90 |
24-48 hrs @ RT |
-60 to +250°F |
Low viscosity, general purpose system. Excellent physical strength and electrical insulation properties. For bonding, sealing, coating & encapsulation. |
| *EP21TCHT-1 |
100/66 |
“A” off white |
light |
30-35 |
18-24 hrs @ RT |
4°K to +400°F |
NASA approved low outgassing. Thermally conductive, room temperature curing system for bonding and sealing. Bonds well to a wide variety of substrates. |
| EP21TDC-2 |
33/100 |
“A” clear |
70,000-80,000 |
75-90 |
72 hrs @ RT |
4°K to +250°F |
Highly flexible with exceptional thermal and mechanical shock resistance. Suitable for cryogenic applications. Superior electrical insulation properties. |
| EP21TDCS |
100/100 |
“A” silver |
smooth paste |
30-40 |
24-36 hrs @ RT |
4°K to +250°F |
High performance, silver filled, toughened system with very low resistance. Excellent adhesive properties. Cryogenically serviceable. Convenient handling. |
| *EP29LPSP |
100/65 |
“A” clear |
700 |
> 6 hrs |
5-7 days @ RT |
4°K to +250°F |
NASA approved low outgassing. Can withstand cryogenic temperatures as well as cryogenic shock. Excellent optical clarity. Very low viscosity. |
| *EP30-2 |
100/10 |
“A” clear |
1,800-2,000 |
20-25 |
24 hrs @ RT |
-60 to +250°F |
NASA approved low outgassing transparent system, excellent for optical and fiber optic bonding & sealing. Superb chemical resistance along with excellent physical strength properties. |
| *EP30AN-1 |
100/10 |
“A” gray |
20,000-30,000 |
30-40 |
24-36 hrs @ RT |
-60 to +250°F |
NASA approved low outgassing with exceptionally high thermal conductivity. Low viscosity. Ideal for potting and encapsulation. Also an excellent adhesive. |
| EP30FL |
100/25 |
“A” amber |
2,000-3,000 |
25-30 |
24 hrs @ RT |
4°K to +250°F |
For high performance sealing, potting, encapsulating and bonding. Excellent flexibility. Cryogenically serviceable. Marvelous electrical insulation properties. |
| *EP30LTE-LO |
10/1 |
“A” off white |
25,000-30,000 |
45-60 |
48 hrs @ RT |
-60 to +250°F |
NASA approved low outgassing, low coefficient of thermal expansion, superb dimensional stability, for bonding, sealing, coating, and small castings. |
| *EP37-3FLFAO |
100/100 |
“A” off white |
18,000-22,000 |
75-90 |
48-60 hrs @ RT |
-4°K to +250°F |
NASA approved low outgassing, good thermal conductivity used for cryogenic sevicability, highly flexible, used for potting, bonding , sealing and casting. |
| EP45HT |
100/30 |
“A” clear |
40,000-50,000 |
12-24 hrs |
1 hr @ 150°F plus |
-80 to +500°F |
High temperature and chemically resistant structural adhesive and sealant. Meets MMM-A-132 type III. Requires heat cure. |
| *EP65HT-1 |
100/10 |
“A” clear |
60,000-70,000 |
3-5 |
20-30 min @ RT |
-60 to +400°F |
NASA approved low outgassing Ultra-fast, room temperature curing adhesive. Resists high temperatures. Excellent bond strength to a wide variety of substrates. |
| EP121CL |
100/80 |
“A” clear |
2,000-3,000 |
>24 hrs |
2-3hrs @ 200°F |
-60 to 500°F |
Low viscosity, high temperature resistant (500°F) potting and impregnation system. Exceptional electrical insulation properties. Requires heat cure. |
| One Component Epoxies — |
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|
|
Viscosity |
|
Storage Stability, RT |
Cure Schedule |
Service Temp Range, °F |
|
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| EP101HTX-3 |
1,000-1,500 |
clear with fluorescent |
6 weeks |
2-6 hrs @ 250°F followed by |
-60 to 500°F |
For impregnation, coating and encapsulation. Very low viscosity. Excellent dielectric properties with extremely low dissipation factor. Exceptionally high temperature resistance. |
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| *Supreme 10HT |
>250,000 |
gray |
6 months |
45 min @ 300°F |
4°K to 400°F |
NASA approved low outgassing , high performance adhesive/sealant. Ultra high bond strength (shear & peel). Cryogenically serviceable. Outstanding toughness and durability. |
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| *Supreme 10HTS |
paste |
silver |
3 months |
45 min @ 300°F |
4°K to 400°F |
NASA approved low outgassing . Silver filled version of Supreme 10HT. Very low resistance (<1 milliohm). Cryogenically serviceable. Exceptionally high shear & peel strength. |
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* all items marked with an asterisk have been tested and meet requirements of ASTM E595.
Master Bond Inc.
Adhesives, Sealants & Coatings • 154 Hobart Street • Hackensack, N.J. 07601 • Tel: 201-343-8983 • Fax: 201-343-2132
Notice: Master Bond believes the information on the data sheets is reliable and accurate as is technical advice provided by the company. Master Bond makes no warranties (expressed or implied) regarding the accuracy of the information and assumes no liability regarding the handling and usage of this product. C033