MASTER BOND MICROELECTRONIC APPLICATION SELECTOR GUIDE
Selected Adhesives, Sealants, Coatings, Encapsulants & Potting Compounds Specially Formulated for Microelectronic Applications
Partial Listing Only –— Other Grades Available
I. ADHESIVES/SEALANTS
| Electrically Insulating — |
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|
Mix Ratio |
Viscosity |
Set-Up Time
|
Cure Schedule |
Service Temp Range, °F |
|
| EP21 |
2 part epoxy |
100/100 |
50,000-60,000 |
60-90 |
24-48 hrs @ RT |
-60 to +250°F |
High performance general purpose adhesive/sealant. Can alter mix ratio to vary toughness and flexibility. |
| EP21ND |
2 part epoxy |
100/100 |
paste |
45-60 |
24-48 hrs @ RT |
-60 to +250°F |
Non-drip version of EP21. Excellent physical & electrical properties. Convenient handling. |
| EP21TDCHT |
2 part epoxy |
100/100 |
100,000-120,000 |
60-90 |
48 hrs @ RT |
-100 to +350°F |
High temperature resistant general purpose system. Excellent adhesion to a wide variety of substrates. |
| EP21TDC-2 |
2 part epoxy |
33/100 |
70,000-80,000 |
75-90 |
72 hrs @ RT |
4°K to +250°F |
Highly flexible with exceptional thermal and mechanical shock resistance. Suitable for cryogenic applications. |
| EP30-1 |
2 part epoxy |
100/25 |
1,500-1,600 |
25-30 |
24-48 hrs @ RT |
-60 to +250°F |
Low viscosity. Transparent. Exceptionally low shrinkage. Superior physical strength & chemical resistance properties. |
| EP30LTE |
2 part epoxy |
100/10 |
15,000-20,000 |
30-40 |
24-48 hrs @ RT |
-60 to +250°F |
Remarkably low coefficient of expansion. Exceptionally low shrinkage. Very high dimensional stability. |
| EP33 |
2 part epoxy |
100/70 |
50,000-60,000 |
50-60 |
24-48 hrs @ RT |
-60 to +450°F |
High temperature resistance. Good physical strength properties & dielectrics. Can resist high radiation levels. |
| EP42LV |
2 part epoxy |
100/40 |
2,000-2,300 |
25-35 |
24-36 hrs @ RT |
-60 to +300°F |
Low viscosity, highly chemically resistant system. Good bond strength to a wide variety of substrates. |
| EP65HT-1 |
2 part epoxy |
100/10 |
60,000-70,000 |
3-5 min |
20-30 min @ RT |
-60 to +400°F |
Ultra-fast curing, high strength system. Superb heat resistance. NASA low outgassing approved. |
| EP45HT |
2 part epoxy |
100/30 |
40,000-50,000 |
12-24 hrs |
1 hr @ 150°F plus |
-80 to +500°F |
High temperature & chemically resistant structural adhesive & sealant. MMM-A-132 type III. Requires heat cure. |
| Supreme 3HT |
1 part epoxy |
1 part |
120,000-135,000 |
30-60 sec |
20-30 min @ 250°F 5-10 min @ 300°F |
-100 to +350°F |
Toughened system. Superior thermal cycling properties as well as excellent mechanical & thermal shock resistance. |
| Supreme 10HT |
1 part epoxy |
1 part |
>250,000 |
3-5 min |
60 min @ 250°F |
4°K to +400°F |
Ultra-high strength (shear & peel), NASA low outgassing approved. Outstanding toughness & durability. |
| Supreme 10HTND-2 |
1 part epoxy |
1 part |
paste |
3-5 min |
60 min @ 250°F |
-100 to +400°F |
Non-drip version of Supreme 10HT with similar physical & mechanical properties. Will not flow when heat cured. |
| MB297FL |
cyanoacrylate |
1 part |
1,500- |
45-60 sec 5 min @ RT humidity dependant |
-40 to +250°F |
Moderate viscosity, toughened system with superior impact and shock resistance. |
|
| MB302 |
cyanoacrylate |
1 part |
75-100 |
15-20 sec 2-3 min @ RT humidity dependant |
-40 to +250°F |
Low viscosity with excellent adhesion to metals, plastics, rubbers and ceramics. |
|
| MasterSil 702 |
1 part silicone |
1 part |
paste |
30-45 sec 24-48 hrs @ RT depends on depth of cure & humidity |
-75 to +400°F |
Non-corrosive type system. Excellent bond strength. Superior electrical insulation properties. |
|
| MasterSil 711 |
1 part silicone |
1 part |
60,000 |
3-5 min 4-6 hrs @ RT depends on depth of cure & humidity |
-75 to +400°F |
Exceptionally fast curing, non-corrosive system. Flowable. For manufacturing and repair applications. |
|
| UV10 |
UV curable |
1 part |
300-400 |
not applicable 5-30 sec depends on depth of cure & light intensity |
-60 to +250°F |
Low viscosity general purpose system. Cures rigid. Excellent resistance to water and other chemicals. |
|
| UV15-7DC |
UV curable |
1 part |
2,500-5,000 |
10-45 sec
plus 15-30 min @ 250°F |
-60 to +300°F |
Dual cure UV. Will cure in shadowed out areas by adding heat (250°F). Excellent physical & electrical properties. |
|
| UV15-7TK1A |
UV curable |
1 part |
paste |
not applicable 5-30 sec depends on depth of cure & light intensity |
-60 to +300°F |
Non-drip system. Low shrinkage & good dimensional stability. Ideal for specialized sealing & bonding applications. |
|
| UV15X-5 |
UV curable |
1 part |
120,000 |
not applicable 5-30 sec depends on depth of cure & light intensity |
-80 to +250°F |
High flexibility. Superb thermal cycling properties. Excellent peel strength and abrasion resistance. |
|
| Thermally Conductive/Electrically Insulating — |
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|
|
Mix Ratio |
Viscosity |
Set-Up Time
|
Cure Schedule |
Service Temp Range, °F |
|
| EP21AO |
2 part epoxy |
100/100 |
light paste |
45-60 |
24-48 hrs @ RT |
-60 to +250°F |
High strength, general purpose system. Widely used for bonding heat sinks. Convenient handling. |
| EP21TDC-2AO |
2 part epoxy |
33/100 |
paste |
90-120 |
48-72 hrs @ RT |
-100 to +250°F |
Excellent flexibility. Superb for bonding substrates with greatly differing coefficients of expansion. |
| EP21ANHT |
2 part epoxy |
100/100 |
paste |
60-80 |
24-48 hrs @ RT |
-60 to +400°F |
High thermal conductivity (22 BTU•in/ft2 •hr•°F at 75°F). Excellent for bonding heat sinks and thermistors. |
| Supreme 11AOHT |
2 part epoxy |
100/100 |
paste |
25-50 |
24-36 hrs @ RT 1 hr @ 200°F |
-100 to +400°F |
Good heat resistance. Excellent thermal cycling properties with dissimilar substrates. Superior insulation properties. |
| Supreme 3AOHT |
1 part epoxy |
1 part |
paste |
1 min |
20-30 min @ 250°F |
-100 to +350°F |
Rapid curing. Good mechanical & electrical insulation properties. Bonds well to dissimilar substrates. |
| Supreme 10ANHT |
1 part epoxy |
1 part |
paste |
5-7 min |
60 min @ 250°F |
-100 to +400°F |
High thermally conductivity (22 BTU•in/ft2 •hr•°F at 75°F). Excellent strength profile. Superb thermal cycling properties. |
| FL901AO |
1 part epoxy |
1 part |
film |
5-10 min |
1 hr @ 250°F
|
-100 to +400°F |
Thermally conductive film. Remarkable strength properties. Standard size is 2”x6”x3 mils thick. Other sizes available. |
| MasterSil 705TC |
1 part silicone |
1 part |
paste |
20-30 24-48 hrs @ RT depends on depth of cure & humidity |
-75 to +400°F |
High conductivity (15 BTU•in/ft2 •hr•°F at 75°F). No-mix system with high heat resistance and superb flexibility. |
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| Electrically Conductive — |
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|
Type of System |
Mix Ratio |
Viscosity |
Set-Up Time
|
Cure Schedule |
Service Temp Range, °F |
Volume Resistivity |
|
| EP21TDCS |
2 part epoxy |
100/100 |
paste |
30-40 |
24-36 hrs @ RT |
4°K to +275°F |
<10-3 |
High performance, silver filled system (resistance < 1 milli-ohm). Easy to use. Excellent physical strength properties. |
| EP77M-F |
2 part epoxy |
100/100 |
paste |
5-10 |
4-6 hrs @ RT |
-60 to +250°F |
<10-3 |
Fast setting, silver filled system. Convenient handling. Widely used in manufacturing & circuit board repair. |
| EP21TDCSFL |
2 part epoxy |
100/100 |
paste |
45-60 |
24-48 hrs @ RT |
4°K to +250°F |
<10-3 |
High flexibility version of EP21TDCS. Very high peel strength. Cryogenic serviceability. Easily repairable. |
| EP76M |
2 part epoxy |
100/100 |
paste |
45-60 |
24-48 hrs @ RT |
-60 to +250°F |
5-10 |
Easy to use, 1 to 1 type, nickel filled system. Excellent physical and mechanical strength properties. |
| Supreme 10HTS |
1 part epoxy |
1 part |
paste |
5-7 min |
1 hr @ 250°F |
4°K to +400°F |
<10-3 |
Silver filled. Wide service temperature range. NASA low outgassing approved. Excellent shear & peel strength. |
| FL901S |
1 part epoxy |
1 part |
film |
5-10 min |
1 hr @ 250°F |
-100 to +400°F |
<0.0002 |
High performance, silver filled film. Standard size is 2” x 6” x 3 mils thick. Other sizes and die cuts available. |
II. POTTING & ENCAPSULATION SYSTEMS
|
|
|
Mix Ratio |
Viscosity |
Set-Up Time
|
Cure Schedule |
Service Temp Range, °F |
|
|
| EP21LV |
2 part epoxy |
100/100 |
6,000-8,000 |
60-90 |
24-48 hrs @ RT |
-60 to +250°F |
Easy to use. Excellent physical properties and chemical resistance. For small and moderate size potting. |
|
| EP30 |
2 part epoxy |
100/25 |
400-500 |
25-30 |
18-24 hrs @ RT |
-60 to +250°F |
Optically clear. Low viscosity. Superb physical strength & electrical insulation properties. Minimal shrinkage. |
|
| EP30AO |
2 part epoxy |
100/10 |
15,000-20,000 |
30-40 |
24-36 hrs @ RT |
-60 to +250°F |
Thermally conductive, electrically isolating. Low viscosity. Good dimensional stability. Very low shrinkage. |
|
| EP30FL |
2 part epoxy |
100/25 |
2,000-3,000 |
25-30 |
24 hrs @ RT |
4°K to +250°F |
Flexible. Marvelous thermal shock resistance. Excellent thermal cycling durability. Cryogenically serviceable. |
|
| EP30HT |
2 part epoxy |
100/25 |
35,000-45,000 |
25-35 |
24 hrs @ RT |
-60 to +400°F |
High temperature resistance. Transparent. Extraordinary physical strength and chemical resistance properties. |
|
| EP30LTE |
2 part epoxy |
100/10 |
15,000-20,000 |
30-40 |
24-48 hrs @ RT |
-60 to +250°F |
Exceptionally low coefficient of expansion system. Features very low shrinkage and high dimensional stability. |
|
| EP37-3FLFAO |
2 part epoxy |
100/100 |
18,000-22,000 |
3 hrs |
4-5 days @ RT |
4°K to +250°F |
Thermally conductive. Electrically insulating. High flexibility & low viscosity. Readily repairable. |
|
| EP41S-4 |
2 part epoxy |
100/25 |
3,000-4,000 |
15-20 |
24 hrs @ RT |
-60 to +300°F |
Superb resistance to chlorinated solvents & acids. Offers outstanding protection for high security potting applications. |
|
| EP3FL |
1 part epoxy |
1 part |
60,000- |
45-60 sec |
20-30 min @ 250°F |
4°K to 250°F |
Cryogenically serviceable, flexibilized system with outstanding thermal cycling & thermal shock resistance. |
|
| EP3RR-1 |
1 part epoxy |
1 part |
120,000- |
45-60 sec |
20-30 min @ 230°F |
-60 to 400°F |
Toughened system with good thermal conductivity & heat resistance. Castable over 1 inch thick. Excellent flowability. |
|
| EP36 |
1 part epoxy |
1 part |
semi-solid |
2 hrs @ 300°F |
-100 to 500°F |
Unique B stage system. Combines superb temperature resistance with high flexibility & elongation. |
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| UV10LV |
UV curable |
one part |
200-250 |
not applicable 5-30 secs depends on depth of cure & light intensity |
-60 to 250°F |
Very low viscosity. Cures rigid and up to 1/8” deep. Good electrical properties and chemical resistance. |
||
| UV15-7SP4 |
UV curable |
one part |
800-1,500 |
not applicable 5-30 secs depends on depth of cure & light intensity |
-80 to 250°F |
Highly flexible & non-yellowing. Excellent thermal cycling properties. Superb thermal shock & impact resistance. |
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| UV15X-2 |
UV curable |
one part |
6,000-8,000 |
not applicable 5-30 secs depends on depth of cure & light intensity |
-80 to 250°F |
Semi-flexible. Will cure over 1/4” deep. Good electrical & non-yellowing properties. Superior chemical resistance. |
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| EP30D12 |
2 part |
100/30 |
800-1,000 |
10-15 |
8-12 hrs @ RT |
-60 to 250°F |
Flexible, rapid curing, low exotherm. Superb abrasion resistance. Unusually superior chemical resistance. |
|
| MasterSil 150 |
2 part silicone |
100/10 |
12,000-15,000 |
3 hrs 24-48 hrs @ RT ambient temperature cure only |
-75 to +400°F |
Cost effective, non-corrosive encapsulant with high flexibility and very low shrinkage during cure. |
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| MasterSil 151 |
2 part silicone |
100/10 |
1,200-1,500 |
4-5 hrs |
24-48 hrs @ RT 2-3 hrs @ 200°F |
-75 to +400°F |
Optically clear. Low outgassing. Will cure at ambient or elevated temperatures. Also for encapsulation. |
|
III. CONFORMAL COATINGS
|
|
|
Mix Ratio |
Viscosity |
Set-Up Time
|
Cure Schedule |
Service Temp Range, °F |
|
| EP21LV-1 |
2 part epoxy |
100/100 |
4,000-6,000 |
60-90 |
24-48 hrs @ RT |
-60 to +250°F |
Easy to use by brushing or dip coating. Excellent physical properties & chemical resistance profile. |
| EP30LV |
2 part epoxy |
100/20 |
200-300 |
35-40 |
24-36 hrs @ RT |
-60 to +250°F |
Low viscosity, clear. Excellent electrical insulation properties & chemical resistance. Applied by spraying or flow coating. |
| EP30DP |
2 part epoxy |
100/10 |
3,000-4,000 |
60-90 |
48 hrs @ RT |
4°K to +250°F |
Toughened system. Allows for repairability. Superb electrical insulation properties. Applied by dipping or spraying. |
| EP19HT |
1 part epoxy |
1 part |
600 |
not applicable |
60 min @ 250°F |
-60 to 400°F |
Easy to use. Good mechanical & electrical insulation properties. Applied by spraying or flow coating. |
| MasterSil 713 |
1 part silicone |
1 part |
3,000 |
15-20 18-24 hrs @ RT depends on depth of cure & humidity |
-75 to +400°F |
Highly flexible, easily repairable system. Non corrosive & fast curing. Applied by brushing, dip coating or spraying. |
|
| MasterSil 773 |
1 part silicone |
1 part |
60-70 |
5 2-4 hrs @ RT depends on humidity |
-75 to +400°F |
Ultra low viscosity. Easily applied by spraying, dipping, brushing or flow coating. Superb humidity & heat resistance. |
|
| UV15 |
UV curable |
1 part |
120-150 |
not applicable 5-30 secs depends on depth of cure & light intensity |
-60 to +350°F |
Excellent heat & chemical resistance. Post curing by heat enhances properties. Optional fluorescent dye available. |
|
| UV15X-5LV |
UV curable |
1 part |
80,000 |
not applicable 5-30 secs depends on depth of cure & light intensity |
-80 to +250°F |
High flexibility. Superb mechanical & thermal shock resistance. Best applied by brushing or dip coating. |
|
| EP56 |
water based urethane |
1 part |
300-400 |
50-60 |
12-24 hrs @ RT |
-75 to +250°F |
Easily processable, low cost system. Excellent electrical properties. Best applied by brushing or dip coating. |
IV. SPECIALTY SYSTEMS
|
|
|
Viscosity |
Cure Schedule |
Service Temp Range, °F |
|
| Supreme 3HTND-2GT |
1 part epoxy |
paste |
5-10 min @ 300°F |
-60 to +350°F |
Glob top. Offers superb protection for circuitry & components including fragile ones. Low ionics. Available in syringes as well as in a thermally conductive version. |
| UV15X-2GT |
UV curable |
paste |
5-30 secs — depends on depth of cure & light intensity |
-80 to +250°F |
Ultra-fast curing glob top. Excellent moisture & chemical resistance. Offers superior durability & superb thermal cycling & shock resistance properties. |
| Supreme 3HTND-1SM |
1 part epoxy surface mount |
thixotropic paste |
5-10 min @ 300°F |
-60 to +350°F |
Rapid curing, high strength surface mount adhesive. Low ionic impurities. “No tailing” application feature. Also available in thermally & electrically conductive versions. |
| MB297 |
cyanoacrylate |
2,400 |
45-60 sec
(set-up) |
-40 to +250°F |
Easy to use, ultra fast curing, high strength wire tack adhesive. Bonds well to most plastics, metals, rubbers and ceramics. |
| UV10TK |
UV curable |
30,000-40,000 |
5-30 secs — depends on depth of cure & light intensity |
-60 to +300°F |
Low shrinkage, rapid curing wire tacking adhesive. Bonds well to most plastics, metals and glass. Superior temperature & chemical resistance. |
| EP3RR-1UF |
1 part epoxy underfill |
120,000-150,000 |
20-30 min @ 220-230°F |
-60 to +400°F |
Epoxy underfill system featuring toughness and rapid curing along with good thermal conductivity and heat resistance. Excellent flowability. |
| AC83 |
acrylic based conductive coating |
paste |
2-4 hrs @ RT |
-60 to +300°F |
Graphite filled, solvent based, conductive coating. Cost effective. Used for EMI / RFI shielding on most plastics and ceramics. Shielding effectiveness >40 dB. |
| X5SC |
rubber based conductive coating |
paste |
2-4 hrs @ RT |
-80 to +250°F |
Silver filled, rubber based flexible coating with excellent peel strength and durability. Shielding effectiveness of >75dB. High solids content. |
| LTX117N |
latex based conductive coating |
flowable |
4-6 hrs @ RT |
-60 to +250°F |
Cost effective, nickel filled, water-based coating with convenient handling properties. Shielding effectiveness of >60dB. Bonds well to most substrates. |
Master Bond Inc.
Adhesives, Sealants & Coatings • 154 Hobart Street • Hackensack, N.J. 07601 • Tel: 201-343-8983 • Fax: 201-343-2132
Notice: Master Bond believes the information on the data sheets is reliable and accurate as is technical advice provided by the company. Master Bond makes no warranties (expressed or implied) regarding the accuracy of the information and assumes no liability regarding the handling and usage of this product. D079