Master Bond Thermally Conductive Selector Guide

MASTER BOND THERMALLY CONDUCTIVE APPLICATION SELECTOR GUIDE

Selected Thermally Conductive, Electrically Insulating Adhesives, Sealants, Coatings, Encapsulants & Potting Compounds

Partial Listing Only –— Other Grades Available

Two Component Epoxies —
	Master Bond Grade	Mix Ratio by weight	Color Code	Mixed Viscosity RT, cps	Set-Up Time Minutes, RT	Cure Schedule Temp/Time, °F	Service Temp Range, °F	Thermal Cond, BTU•in/ft²•hr•°F	Applications
	EP21AO	100/100	“A” gray “B” white	light paste	45-60	24-48 hrs @ RT 2-3 hrs @ 200°F	-60 to +250°F	10	High strength, general purpose system. Easy to process. Widely used for bonding heat sinks.
	EP21AOHT	100/100	“A” gray “B” off white	paste	60-80	24-48 hrs @ RT 1-2 hrs @ 200°F	-60 to +400°F	10	High temperature resistant version of EP21AO. Also has enhanced chemical resistance properties.
	EP21ANHT	100/100	“A” light gray “B” light gray	paste	60-80	24-48 hrs @ RT 1-2 hrs @ 200°F	-60 to +400°F	23	High conductivity version of EP21AOHT. Excellent for bonding heat sinks and thermistors.
	EP21AOLV	100/100	“A” gray “B” white	40,000- 50,000	75-90	24-48 hrs @ RT 2-3 hrs @ 200°F	-60 to +250°F	10	Low viscosity version of EP21AO. Good flowability. For potting and encapsulating. Convenient processing.
	EP21TDCAOHT	100/100	“A” gray “B” off white	paste	120-140	24-48 hrs @ RT 2-3 hrs @ 200°F	-60 to +400°F	10	Toughened system with high peel and shear strength. Good resistance to high vibration and mechanical shock.
	EP21TDCANHT	100/100	“A” gray “B” gray	paste	120-140	24-48 hrs @ RT 2-3 hrs @ 200°F	-60 to +400°F	25	High conductivity version of EP21TDCAOHT. Bonds well to dissimilar substrates. Good thermal cycling properties.
	EP21TDC-2AO	33/100	“A” white “B” off white	paste	90-120	48-72 hrs @ RT 3 hrs @ 200°F	-100 to +250°F	10	Excellent flexibility. Superb for bonding substrates with greatly differing coefficients of expansion.
	EP21TCHT-1	100/66	“A” off white “B” off white	light paste	30-35	18-24 hrs @ RT 1-2 hrs @ 200°F	4°K to +400°F	11	NASA low outgassing certified. Excellent adhesive and sealant, particularly in high vacuum applications.
	EP30AO	100/10	“A” off white “B” clear	15,000- 20,000	30-40	24-36 hrs @ RT 1-2 hr @ 200°F	-60 to +250°F	10	Low viscosity. Good flowability. Primarily for potting and encapsulating. Excellent physical strength profile.
	EP30AN	100/10	“A” gray “B” clear	20,000- 30,000	30-40	24-36 hrs @ RT 1-2 hrs @ 200°F	-60 to +250°F	25	High thermal conductivity version of EP30AO. Excellent electrical insulation properties. Very low shrinkage.
	EP30BN	100/10	“A” white “B” clear	15,000- 25,000	30-40	24 hrs @ RT 1-2 hrs @ 200°F	-60 to +250°F	24	Special high conductivity, low density system. For light-weight aerospace potting applications.
	EP30AOHT	100/10	“A” off white “B” clear	70,000- 80,000	30-35	24-36 hrs @ RT 1-2 hrs @ 200°F	-60 to +400°F	10	High temperature resistant version of EP30AO. For potting and encapsulating. Excellent flow properties.
	EP30ANHT	100/10	“A” light gray “B” clear	70,000- 80,000	30-35	24-36 hrs @ RT 1-2 hrs @ 200°F	-60 to +400°F	23	High thermally conductive version of EP30AOHT. Also for potting & encapsulation. Low coefficient of expansion.
	EP30AN-1	100/10	“A” gray “B” clear	20,000- 30,000	30-40	24 hrs @ RT 1-2 hrs @ 200°F	-60 to +250°F	25	NASA approved low outgassing version of EP30AN. For high vacuum bonding & potting applications.
	EP37-3FLFAO	100/100	“A” white “B” white	18,000- 22,000	3 hrs	4-5 days @ RT 4-6 hrs @ 200°F	-80 to +250°F	10	High flexibility and elongation. Low viscosity. For potting and encapsulation. Offers easy repairability.
	EP51M-AO	100/100	“A” gray “B” amber	paste	3-5 min	2-4 hrs @ RT	-60 to +250°F	10	Extremely fast curing, easily processable system with good physical strength properties.
	EP121AO	100/80	“A” white “B” white	35,000- 45,000	12-24 hrs	3 hrs @ 200°F plus 8-10 hrs @ 300°F	-60 to 500°F	10	For high temperature potting. Low viscosity. Excellent electrical insulation properties. *Requires heat cure.*
	Supreme 11AO	100/100	“A” gray “B” amber	paste	20-30	24 hrs @ RT 1 hr @ 200°F	-100 to +250°F	10	Toughened system. For bonding and sealing. High shear and peel strength. Superior shock resistance.
	Supreme 11AOHT	100/100	“A” gray “B” white	paste	25-50	24-36 hrs @ RT 1 hr @ 200°F	-100 to +400°F	10	High heat resistant version of Supreme 11AO. Good thermal cycling properties with dissimilar substrates.
	Supreme 11ANHT	100/100	“A” gray “B” white	paste	25-50	24-36 hrs @ RT 1 hr @ 200°F	-100 to +400°F	25	High thermal conductivity version of Supreme 11AOHT with similar electrical and physical strength properties.

One Component Epoxies —
	Master Bond Grade		Viscosity RT, cps	Color Code	Storage Stability, RT	Cure Schedule Temp/Time, °F	Service Temp Range, °F	Thermal Cond, BTU•in/ft²•hr•°F	Applications
		EP3RR-1	120,000-150,000	light yellow	3 months@75°F 6 months@40°F	5-10 min @ 300°F 20-30 min @ 220-230°F	-60 to +400°F	6	Rapid curing, toughened system. Excellent flowability. For potting and underfill applications.
		EP3AOHT	paste	gray	6 months	5-10 min @ 300°F 20-30 min @ 250°F	-60 to +400°F	10	Fast curing adhesive/sealant with high bond strength and low shrinkage. Widely used in chip bonding.
		EP36AO	semi-solid melts at 180°F	light tan	6 months	2 hrs @ 300°F uncured material reusable	-100 to +500°F	10	Excellent heat resistance. Good flexibility. Used for potting. Passes Class H thermal insulation specs.
		EP36AN	semi-solid melts at 180°F	light gray	6 months	2 hrs @ 300°F uncured material reusable	-100 to +500°F	25	Higher thermally conductive version of EP36AO. Excellent thermal shock and cycling resistance.
		FL901AO	film	gray	6 months @ 40°F	1 hr @ 250°F 30-40 min@300°F	-100 to +400°F	10	Film adhesive/sealant. Standard size is 2” x 6” x 3 mils thick. Other sizes and preforms available.
		Supreme 3AOHT	paste	off-white to light yellow	6 months	5-10 min @ 300°F 20-30 min @ 250°F	-100 to +350°F	10	Rapid curing. Good mechanical & electrical insulation properties. Bonds well to dissimilar substrates.
		Supreme 3ANHT	smooth paste	gray	6 months	10 min @ 300°F 30 min @ 250°F	-100 to +400°F	22	High thermally conductive version of Supreme 3AOHT. Superior thermal cycling & shock resistant properties. .
		Sup. 3HTND-2GTAO	thixotropic paste	light yellow	6 months	5-10 min @ 300°F	-60 to +350°F	8	Thermally conductive glob top. Low ionic impurities. Creates low stress for delicate components.
		Supreme 10AOHT	paste	light gray	6 months	45 min @ 300°F 60 min @ 250°F	-100 to +400°F	10	High performance, toughened adhesive/sealant. Good electrical insulator. Exceptional bond strength.
		Supreme 10ANHT	paste	gray	6 months	45 min @ 300°F 60 min @ 250°F	-100 to +400°F	24	High thermally conductive version of Supreme 10AOHT. Superb dimensional stability & shock resistance.

Miscellaneous —
	Master Bond Grade	Color	Mix Ratio by weight	Viscosity cps	Storage Stability, RT	Cure	Service Temp Range, °F	Thermal Cond, BTU•in/ft²•hr•°F	Applications
	MasterSil 705TC	white	one part	paste	6 months	air (moisture) 24-48 hrs	-75 to +400°F	15	Silicone adhesive/sealant with high flexibility & excellent temperature resistance. Exceptionally easy processing.
	X-5TC	tan	one part	paste	3 months	solvent evaporation 8-12 hrs	-75 to +250°F	11	Easy to use rubber based adhesive system. Good bond strength and flexibility. Convenient processing.

Master Bond Inc.

Adhesives, Sealants & Coatings • 154 Hobart Street • Hackensack, N.J. 07601 • Tel: 201-343-8983 • Fax: 201-343-2132

Notice: Master Bond believes the information on the data sheets is reliable and accurate as is technical advice provided by the company. Master Bond makes no warranties (expressed or implied) regarding the accuracy of the information and assumes no liability regarding the handling and usage of this product. D019