One Component, Epoxy System for Bonding, Sealing and Coating Featuring Very Fast Cure along with High Strength Properties. Meets NASA low outgassing specifications.
Two Component, Black Colored, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Low Coefficient of Expansion and Passes NASA Outgassing Tests with Low Shrinkage Upon Cure.
One component die attach epoxy system with exceptionally high glass transition temperature. Resists temperatures up to +600°F. Thermally conductive, electrically insulating, Paste consistency.
