One Component, Epoxy System for Bonding, Sealing and Coating Featuring Very Fast Cure along with High Strength Properties. Meets NASA low outgassing specifications.
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Meets ISO 10993-5 for cytotoxicity. Graphite filled. Thermally conductive, electrically conductive, high compressive strength.
Two Component, Black Colored, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Low Coefficient of Expansion and Passes NASA Outgassing Tests with Low Shrinkage Upon Cure.
Two component, epoxy compound with a paste consistency, outstanding shear and peel strength for bonding, sealing and coating, featuring excellent adhesion to engineering plastics and metals, especially polycarbonates and acrylics
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength..
