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Master Bond Polymer System AC85 Product Description

 

MASTER BOND POLYMER SYSTEM AC85
Solvent Based Highly Electrically Conductive Silver Filled Adhesive/Sealant
  • Composition: Oxidation and chemically resistant adhesive polymeric binder and suspended, non- oxidizing, conductive silver particles.
  • Service temperature range: - 80°F to -300°F
  • Storage stability: 3 months in original containers at ambient temperature conditions.
  • Convenient handling: One component system, no need for catalysts or accelerator additions.
  • Application: Brushing, dipping, air and airless spraying equipment, silk screening; viscosity can be readily adjusted with compatible solvents such as toluene, xylene and methylene chloride; typical application is 1 mil, single pass; avoid dry spray for maximum adhesion and conductivity.
  • Surface resistance: 0.03 ohms/square @ 1.5-2.0mil.
  • EMI performance: 60-70 dB
  • ESD performance: Excellent
  • Color: Silver
  • Excellent long term durability even when exposed to adverse environmental conditions.
  • Cost effective: Excellent durable performance and easy application with high area coverage.
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