Master Bond EP110 is a solventless low viscosity epoxy resin system with a long pot life at room temperature which is specifically designed for impregnation and casting operations. It cures readily at elevated temperatures to a tough strong solid with outstanding thermal shock resistance and excellent electrical insulation properties. Adhesion to metals and other substrates is excellent. There is no cracking or separation of cured EP110 resin from metal over a wide temperature range. Physical and electrical properties of the cured EP110 resin system are superior to those exhibited by typical room temperature cured epoxy resin compounds.