Master Bond Polymer System EP110F6 is a two component high performance epoxy resin system with a long pot life at room temperature which is specifically designed for potting, sealing, encapsulating and casting. It requires an elevated temperature cure. The cured EP110F6 is a "tough" system with outstanding thermal shock resistance and superb thermal cycling properties along with excellent electrical insulation characteristics. It adheres well to metals and a wide variety of other substrates. The physical and electrical properties of the cured EP110F6 are superior to those of most systems with a room temperature cure as well as other heat cured systems. It resists a wide range of chemicals. The color of part A is clear while the color of part B is amber. Most importantly, EP110F6 passes the Navy "Hex Bar" Test, MIL I-16923C, consisting of 10 cycles, -55°C to +155°C. It is widely used in applications were high performance electrical insulation properties and resistance to thermal cycling are required. It should be noted that the typical cure schedule for EP110F6 consists of a 3-5 hour cure at 125°C and that enhanced performance properties can be achieved with an additional 2-3 hour 150°C post cure.