Master Bond Polymer System EP11C is a new superior and cost effective one component epoxy resin system featuring high electrical, superior conductivity for electrical contacts, bonding, sealing and coating which combines high physical strength properties with remarkable thermal shock, heat and chemical resistance including water and many organic solvents. It has a service temperature range of -60°F to over 300°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP11C offers the application convenience of a one component electrically conductive epoxy resin system which does not require any mixing before use plus flexible cure schedules so as to best meet specific application requirements. It is 100% reactive and does not contain any solvents or diluents.

Master Bond Polymer System EP11C is supplied in the form of a high viscosity paste having a minimum storage stability of more than 4 months when stored at temperatures of around 75 +- 50°F. Refrigeration greatly extends the storage stability of this epoxy resin system. Gel times and cure schedules depend upon temperature. The gel time at 300°F is in the order of 20-25 minutes. The cure time at 300°F is in the order of 60-80 minutes and at 350°F in the order of 40-50 minutes.