Master Bond Polymer System EP11HT is a one component, heat curing, structural epoxy adhesive featuring high shear strength, easy handling and high temperature resistance. This one component system is formulated to cure at elevated temperatures, e.g. 90-120 minutes at 250°F or 60-90 minutes at 300°F. The minimum cure temperature is 250°F. EP11HT attains tensile shear strengths in excess of 3,300 psi and forms rigid and dimensionally stable bonds. The service temperature range is -60°F to 400°F. As a one part system, it does not require mixing prior to use and has an unlimited working life at room temperature. EP11HT bonds well to a wide variety of substrates including metals, glass, ceramics and most plastics. It has excellent resistance to a wide range of chemicals including acids, bases, oils, salts and many solvents. A non-drip version called EP11HTND-2 is also available. Both systems are 100% reactive and do not contain any solvents or volatiles. The standard color is tan, but other colors are available. The cured adhesive fully meets the requirements of MIL-MMM-A-132.