Master Bond Polymer System EP11S is a new superior performance and cost effective one component epoxy resin system featuring excellent electrical conductivity for electrical contacts, bonding sealing and coating and combines high physical strength properties with remarkable thermal shock, heat and chemical resistance including water, fuels and many organic solvents. It has a service temperature range of -60°F to over 300°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP11S offers the application convenience of a one component electrically conductive epoxy resin system which does not require any mixing before use plus flexible cure schedules so as to best meet specific application requirements. It is 100% reactive and does not contain any solvents or diluents. Master Bond System EP11S is specially formulated to minimize objectionable ionic impurities such as hydrolyzable chlorides.