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Master Bond Polymer Adhesive EP21AOHT Product Description

 

MASTER BOND POLYMER ADHESIVE EP21AOHT
Two Component, Room Temperature Curing, Thermally Conductive,
Electrically Insulating Epoxy Adhesive, Sealant and Coating Featuring
a 1:1 Mix Ratio and High Temperature Resistance Up To 400°F

Master Bond Polymer Adhesive EP21AOHT is a high temperature resistant, two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics, and many plastics. As a thermally conductive adhesive it forms high strength bonds of over 2000 psi tensile shear. EP21AOHT resists a wide range of chemicals including water, oils, fuels, and some solvents over the temperature range of -60°F to +400°F. It also possesses a low coefficient of expansion and excellent dimensional stability.

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