Master Bond Polymer Adhesive EP21CL-1 is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures with a two-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. Master Bond Polymer Adhesive EP21CL-1 can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60 F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The adhesive is widely used in the electronic, electrical, computer, construction, metal working, appliance, automotive and chemical industries.

The cured adhesive fully meets the requirements of MIL-A-81236 (OS), MMM-A-134-Type I.