Master Bond Polymer System EP21DP11 is a low viscosity, two component flame retardant epoxy compound for high performance, chemical resistant casting, coating, and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This compound is 100% reactive and does not contain any solvents or other volatiles. It contains a special air release agent. Master Bond Polymer System EP21DF11 is particularly recommended where a low viscosity is required and cured coatings or castings must withstand severe environmental conditions and also exposure to various chemicals and temperature cycling up to 275°F. Adhesion to both similar and dissimilar substrates is excellent. The hardened material is an electrical insulator. Color of part A is red; part B is clear tan. Master Bond Polymer System EP21DP11 is widely used in the electronic, electrical, computer, construction, appliance, metal working, automotive and chemical industries. The compound meets MIL-I-46O58C requirements.