Master Bond Polymer System EP21F is a two component epoxy compound for high performance casting and bonding formulated to cure at room temperature or more rapidly at elevated temperature, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy compounds, is relatively insensitive to mixing ratio or substrate cleaning procedures. Master Bond Polymer Compound EP21F can be applied readily by conventional casting and bonding techniques. It produces durable high strength andtough castings and bonds which are remarkably resistant to thermal cycling and chemicals including fuels, water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 300°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened compound is an excellent electrical insulator. Color of part A black, part B amber. Master Bond EP21F System is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries for casting, potting, encapsulation and bonding.