Master Bond Polymer System EP21FR is a two component flame retardant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to substrate cleaning procedures. The cured resin system features durability, toughness and high strength properties and is remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened compound is an electrical insulator. Color of part A red part B white Master Bond EP21FR compound is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. It complies with UL94-VO and other critical flame retardant specifications.