Master Bond Polymer Adhesive EP21HTAOTDC is a two component thermally conductive epoxy adhesive for high performance bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 2800 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. The EP21HTAOTDC epoxy resin system furthermore features very high peel strength after room temperature cure. Master Bond Polymer Adhesive EP21HTAOTDC can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organ solvents, over the exceptionally wide temperature range of -60°F to 400°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an excellent electrical insulator. Color of part A gray, part B amber. Master Bond EP21HTAOTDC adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.