Master Bond Polymer System EP21HTTDC is a unique two component, toughened epoxy compound for high performance bonding, sealing and casting featuring high peel strength, superior resistance to vibration, impact and shock for service up to 400°F. It is formulated to cure at ambient temperatures or more rapidly at elevated temperatures with a noncritical one-to-one mix ratio. The Master Bond EP21HTTDC compound features high physical strength properties including a tensile shear strength of more than 2800 psi at ambient temperatures, a peel strength of more than 35 pli, excellent electrical insulation characteristics, good thermal shock resistance and a high degree of resistance to the action of many chemicals such as water, acids, bases, fuels and various organic solvents. It can be used over the exceptionally wide temperature range of -65°F to +400°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and most plastics is excel-lent. Master Bond EP21HTTDC is 100% reactive and does not contain any solvents or dilutents. It is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical process industries.