Master Bond Polymer System EP21LM-1 is a two component, low viscosity epoxy resin system for high performance bonding, encapsulation and coating. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. Master Bond EP21LM-1 readily develops high physical strength properties at ambient temperatures which unlike those of many other epoxy compounds are relatively insensitive to mixing ratio or substrate condition. It can be readily applied for bonding, encapsulation and coating applications. The cured polymer features remarkable resistance to thermal cycling and many chemicals including water, oil, fuels and most organic solvents over the wide temperature range of -65°F to more than +250°F. Adhesion to metals, glass ceramics, wood, vulcanized rubbers and many plastics is excellent. The EP21LM-1 system is a very superior electrical insulator. Color of part A is black, part B is amber. Master Bond EP21LM-1 system is widely used in the electronic, electrical, computer, construction, metal working, appliance, automotive and chemical industries. It is 100% reactive and does not contain any solvents or diluents.