Master Bond Polymer Adhesive EP21LP-IND is a two component, high strength epoxy adhesive for high performance general purpose bonding and sealing formulated to feature long pot life (2-4 hours) at room temperature and cure well at moderately elevated temperatures e.g. 148°F (60°C) or more rapidly at higher temperatures e.g. 212-300°F (100-150°C). It readily develops a high bonding strength of more than 2500 psi at room temperature. Master Bond Polymer Adhesive EP21LP-IND can be applied readily after simple mixing of the two components on many different surfaces. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B tan. Master Bond EP21LP-IND adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. The cured material fully meets the performance requirements of MIL-A-82136(0S) and also MMM-A-134 Type I.