MASTER BOND POLYMER ADHESIVE EP21TPLV

Two Component, Low Viscosity, Toughened Epoxy Polysulfide Compound

for Fastening, High Performance Bonding, Sealing and Casting

Product Properties

Master Bond Polymer Adhesive EP21TPLV is a two component low viscosity, exceptionally tough epoxy polysulfide composition formulated to cure quickly at ambient and even more rapidly at moderately elevated temperatures with a noncritical, user-friendly one-to-one mix ratio, weight or volume. It readily develops high physical strength properties, superior bonding and sealing characteristics to many different metallic and also nonmetallic substrates, excellent electrical insulation properties and remarkably high chemical resistance. As shrinkage during cure is minimal, dimensional stability of the cured polymer system is most satisfactory indeed. Other desirable performance properties are maximun impact resistance to thermal cycling as well as mechanical vibration and shock, also resistance to a wide variety of organic solvents and fuels plus many aggressive inorganic chemicals. The adhesion of the Master Bond Polymer System EP21TPLV is particularly noteworthy to metal, glass, ceramic, wood, vulcanized elastomers and many different plastics. The cured compound is a superior electrical insulation material. The service temperature range extends from as low as -80°F to in excess of 250°F. Master Bond Polymer System EP21TPLV is finding many significant applications in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. Availabe clear and in a wide range of colors.