Master Bond Polymer Adhesive EP21ND-2 is a two component epoxy adhesive for general purpose bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature. Master Bond Polymer Adhesive EP21ND-2 can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and many organic solvents, over the wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The cured epoxy is an electrical insulator, with good dielectrics. Color of part A gray, part B amber. Master Bond EP21ND-2 adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

The cured adhesive fully meets the requirements of MIL-A-81236 (OS), MMM-A-134 Type 1.