Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, a very forgiving 1 to 1 mix ratio by weight or volume and a special no drip application feature. EP21ND has the unusual characteristic of being able to adjust the properties of the cured system by altering the mix ratio. Adding more A part (e.g. 2:1 mix ratio) will give a more rigid cure while adding more B part (e.g. 1:2 mix ratio) gives a more forgiving cure. EP21ND can be applied without sagging or dripping even on vertical surfaces. EP21ND produces high strength, durable bonds which hold up well to thermal cycling and resist many chemicals including water, oils, fuels, acids, bases and salts. It is serviceable over the wide temperature range of -60°F to +250°F. It bonds well to a variety of substrates including metals, glass, ceramics, wood, rubber and many plastics. Once cured, EP21ND is an excellent electrical insulator. This exceptionally versatile system is widely used in the electronic, electrical, computer, metalworking, appliance, automotive, chemical and OEM industries. While the standard color of the cured material is gray, a wide variety of additional color choices are also available. A special version called EP21ND-4 is also available that maintains its no drip properties even if heat is added to accelerate the cure.