Master Bond Polymer System EP21Q is a two component quartz filled epoxy compound for abrasion resistant coatings, sealing and bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio by weight or volume. It readily develops a high bond strength of 2900 psi at room temperature ratio. Master Bond Polymer System EP21Q can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength bonds which are remarkably resistant chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B tan. Master Bond EP21Q is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.