Master Bond Polymer System EP21SC is a two component silicon carbide containing epoxy resin compound for high performance abrasion resistant, tough coatings, liners and adhesive/sealants formulated to cure at room temperature or more rapidly at elevated temperatures, with a convenient, non-critical one-to-one mix ratio, weight or volume. It is 100% reactive, does not contain any solvents or diluents and cures with minimal shrinkage. Master Bond Polymer System EP21SC readily develops a high bonding strength of more than 3000 psi at room temperature to both metallic and many non-metallic substrates. Master Bond Polymer System EP21 SC produces exceptionally abrasion resistant, tough and high strength coatings, liners and adhesive/sealants which are remarkably resistant to thermal cycling and chemicals including water, oils, hydraulic fluids, salt solutions and most organic solvents over the wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, cements, wood, vulcanized rubbers and many plastics is excellent. The hardened epoxy resin compound exhibits surprisingly good thermal conductivity compared to various other epoxy resin systems and is an electrical insulator. The thermal expansion coefficient is desirably low. Color of part A gray, part B tan. Master Bond Polymer System EP21SC is widely used in the construction, maintenance and repair, chemical process, metalworking, appliance and electrical/electronic industries where durable high performance, abrasion resistant tough coatings, liners and adhesive/sealants are required.