Master Bond Polymer System EP21SI is a two component, high performance, electrically isolating epoxy composition for potting, adhesive, sealant, and coating applications with a noncritical 1:1 mix ratio by weight or volume. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics, and many plastics. It cures readily at ambient or more quickly at elevated temperatures. Shinkage on cure is exceptionally low. EP21SI resists a wide range of chemicals including water, oils, fuels, acids, alkalis and many solvents over the temperature range of -60°F to +275°F. It also possesses a low coefficient of expansion and excellent dimensional stability. A low viscosity version called EP21SILV is also available. That system is particularly well suited for potting applications where high dimensional stability and long term durability are required.