EP21TDC-2 Product Description

Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding, sealing, coating and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperatures with a non-critical one to three mix ratio by weight. The cured compound has very high peel strength, greater than 30 pli, and an elongation of over 150%. EP21TDC-2 develops very little exotherm while curing, making it well suited for potting or encapsulating in thicker sections. It is ideal for bonding different substrates including metals, glass, ceramics and a wide array of rubbers and plastics. Its superior flexibility allows EP21TDC-2 to have excellent thermal cycling properties along with exceptional resistance to thermal and mechanical shock and vibration. The cured epoxy is a superb electrical and thermal insulator with outstanding resistance to chemicals such as water, oils, hydraulic fluids, bases and salts. Master Bond EP21TDC-2 is widely used in the electronic, electrical, optical, aerospace and related industries. In addition, EP21TDC-2 has wide applicability as both an adhesive and sealant in cryogenic environments. Its service temperature range is 4K to 250°F. A lower viscosity version called EP21TDC-2LV as well as a non-drip version called EP21TDC-2ND are also available. All three versions of EP21TDC-2 are 100% reactive and contain no solvents or volatiles.

Product Advantages

• Easy application: product spreads evenly and smoothly.
• Cures readily at ambient temperature or faster at elevated temperatures.
• Variable hardness and flexibility depending upon cure schedule.
• High peel strength and elongation.
• Excellent mechanical and thermal shock resistance.
• Bonds well to a wide array of materials.
• Good abrasion resistance.
• Outstanding electrical insulation properties.
• Serviceable at cryogenic temperatures down to 4K.