Master Bond Polymer System EP21TDC-2LO is a low outgassing two component highly flexible, thermally conductive epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient one to three mix ratio by weight. The cured compound exhibits high elongation and excellent toughness. As very little exotherm is developed during cure the Master Bond EP21TDC-2LO is suitable for potting and encapsulating thick as well as thin sectioned configurations. This epoxy resin compound exhibits superior tensile shear and peel strength for bonding and sealing applications. It adheres well to many different substrates including metals, glass, ceramics, rubber and plastics. The hardened composition is an excellent electrical insulator with outstanding resistance to chemicals including water, acids, bases and salts. The service temperature range is from 4K to 250°F making it suitable for many cryogenic applications. Master Bond EP21TDC-2LO is widely used in the electronic, electrical, optical, fiberoptic, aerospace and other industries where low outgassing, flexibility, and thermal conductivity are desirable.