Master Bond Polymer System EP21TDC-4 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one-to-four mix ratio by weight. The cured system has a high peel strength of >30 pli and an elongation of over 300%. The EP21TDC-4 bonds well to a wide variety of rubbers, metals and plastics. It may adhere well to untreated rubber materials such as neoprene, nitrile, EPDM and SBR rubber compounds that normally require time consuming surface preparation, thereby reducing handling and processing costs and eliminating hazardous and corrosive chemicals. The cured system has excellent electrical insulation properties along with superior chemical resistance to oils and water. It has an operating temperature range of -100°F to +250°F, with superb low temperature serviceability. The EP21TDC-4 will even cure in an underwater environment! It is widely used in OEM, electrical, electronic, repair and maintenance type applications. The EP21TDC-4 is also available in a non-drip version, called EP21TDC-4ND.