Master Bond Polymer System EP21TDC-4HT is a unique two component, toughened epoxy compound for high performance bonding, sealing and casting featuring high peel strength, superior resistance to vibration, impact and shock for service up to 400°F. It is formulated to cure at ambient temperatures or more rapidly at elevated temperatures. The Master Bond EP21TDC-4HT compound features high physical strength properties including a tensile shear strength of more than 2800 psi at ambient temperatures, a peel strength of 36 pli, excellent electrical insulation characteristics, good thermal shock resistance and a high degree of resistance to many chemicals such as water, acids, bases, fuels and various organic solvents. It can be used over the exceptionally wide temperature range of -65°F to +400°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and most plastics is excellent. Master Bond EP21TDC-4HT is 100% reactive and does not contain any solvents or diluents. It is widely used in the electronic, electrical, computer, construction, metalworking, applicance, automotive and chemical process industries.