Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 2800 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. The EP21TDC epoxy resin system furthermore features very high peel strength after room temperature cure. It produces durable high strength and tough castings which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -100°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A clear, part B amber. Master Bond EP21TDC adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. A non-drip version, EP21TDCND is also available, as well as a faster curing version called EP21TDCF3. The cured adhesive fully meets the requirements of MIL-A-81236 (OS), MMM-A-134-Type 1.