Master Bond Polymer System EP21TDCF-1 is a two component epoxy adhesive for high performance bonding formulated to cure quickly at room temperature or more rapidly at elevated temperatures, with a one-to-one non critical mix ratio, weight or volume. It readily develops a high bonding strength of more than 1700 psi at room temperature which, unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. The EP21TDCF-1 epoxy resin system furthermore features very high peel strength after room temperature cure. It produces durable high strength and tough bonds and seals which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -100°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B amber. Master Bond EP21TDCF-1 is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. A non-drip version, EP21TDCF-1ND is also available as well as a faster curing version called EP21TDCF3. The cured adhesive fully meets the requirements of MIL-A-81236 (OS), MIS-21030E and other specifications. It cures fully under water.