Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive epoxy systems, the EP21TDCN has a one-to-one mix ratio, by weight or volume. It readily develops a high bonding strength of more than 1800 psi tensile shear and a T-peel of greater than 20 pli when measured and cured at 75°F. It is 100% reactive and does not contain any diluents or solvents. The volume resistivity of the cured system is 5-10 ohm-cm.

Master Bond Polymer System EP21TDCN can be applied with minimal sagging or dripping even on vertical surfaces although it can be made thinner (flowable) by adding 5 to 10% of an appropriate solvent (xylene, acetone, toluene, etc.) by weight. The high strength bonds respond well to thermal cycling and are resistant to chemicals including water, oil and most organic solvents. EP21TDCN has a service temperature range of -100°F to more than +275°F. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Parts A and B are both colored nickel. Master Bond EP21TDCN adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance, and automotive applications. For convenient handling, EP21TDCN is now available in premixed and frozen syringes.