Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This easy to handle two part silver conductive epoxy has a one-to-one mix ratio, by weight or volume. It readily develops a high bonding strength of more than 1,500 psi tensile shear and a T-peel of greater than 30 pli when cured and measured at 75°F. It is 100% reactive and does not contain any diluents or solvents. The volume resistivity of the cured system is very low - less than 10^-3 ohm-cm.

EP21TDCSFL can be easily applied with minimal sagging on vertical surfaces. It can be made thinner (flowable) by adding 5 to 10% of an appropriate solvent by weight such as xylene, acetone, MEK, etc. As a sealant it resists a wide range of chemicals including water, oils and most organic solvents over the exceptionally wide temperature range of 4K to +250°F, enabling it to be serviceable even in cryogenic applications. Adhesion to metals, glass, ceramics, rubbers and many plastics is excellent. Its exceptional flexibility makes EP21TDCSFL particularly useful in bonding dissimilar substrates that are being thermally cycled and shocked. Additionally, its high flexibility combined with its inherently low shrinkage enables the cured system to exert very little mechanical stress on sensitive components and substrates. Also, the highly flexible EP21TDCSFL is easier to remove than most silver epoxies, making it well suited for repair type applications. Parts A and B are both colored silver. Master Bond EP21TDCSFL adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance, and automotive industries among others. For convenient handling, EP21TDCSFL is now available in premixed and frozen syringes.