Master Bond Polymer Adhesive EP21TPLV is a two component low viscosity, exceptionally tough epoxy polysulfide composition formulated to cure quickly at ambient temperature and even more rapidly at elevated temperatures with a noncritical, user-friendly one-to-one mix ratio, weight or volume. It develops high physical properties, superior bonding and sealing to many different metallic and nonmetallic substrates, excellent electrical insulation properties and remarkably high chemical resistance. Shrinkage during cure is minimal. Other desirable performance properties are maximun impact resistance to thermal cycling as well as mechanical vibration and shock. EP21TPLV has excellent resistance to a wide variety of organic and inorganic solvents and fuels. Master Bond Polymer System EP21TPLV bonds well to metal, glass, ceramic, wood, vulcanized elastomers and many different plastics. The cured compound is a superior electrical insulator. The service temperature range extends from as low as -80°F to in excess of 250°F. Master Bond Polymer System EP21TPLV is finding many significant applications in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. Availabe clear and in a wide range of colors.