Master Bond Polymer System EP30-3 is a two component, low viscosity, epoxy resin system featuring optical clarity, high physical strength properties, outstanding chemical resistance and superior high temperature properties. Excellent mechanical strength characteristics and remarkably high heat deflec-tion temperatures make this polymer system particularly useful for use in casting, potting, encapsulation, laminating, filament winding, rim/rim uses as well as for bonding either similar or dissimilar metallic and/or nonmetallic substrates. Its excellent color, high thermal stability and superior electrical insulation charac-teristics make it particularly useful for optical, electro/optics and related applications.