Master Bond Polymer System EP30ANHT is a two component epoxy resin system for high performance general purpose bonding, sealing and potting formulated to cure at room temperature or more rapidly at elevated temperatures, with a convenient ten to one (10:1) mix ratio by weight. It readily develops an unusually attractive balance of performance properties including unmatched high thermal conductivity, excellent electrical insulation characteristics and superior dimensional stability as well as good physical strengths, thermal shock resistance and high bonding strengths of as much as 2100 psi. The durable, rigid, high strength bonds produced are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to 400°F. The thermal expansion coefficient is desirably low. Color of part A is off white, part B clear. The Master Bond EP30ANHT compound is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries where electrical insulation and environmental protection are required and superior heat transfer must be maintained. The flowability enables its usage for electronic potting and encapsulation. A non drip version for application on vertical surfaces is available.