Master Bond Polymer System EP30AOSP is a two component epoxy resin system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures with a 100-to-06 (100/6) mix ratio by weight. It has an attractive balance of performance properties including high thermal conductivity, excellent electrical insulation characteristics and superior dimensional stability, as well as good physical strength properties. EP30AOSP is low viscosity with excellent flow characteristics making it ideal as a thermally conductive potting epoxy. EP30AOSP is also an excellent adhesive/sealant forming durable, rigid bonds that are resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the wide temperature range of -60°F to 250°F. The thermal expansion coefficient is desirably low. Color of part A is off white, part B is clear. Master Bond EP30AOSP is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where electrical insulation and environmental protection are required and heat transfer must be maintained.