Master Bond Polymer System EP30BN is a two component boron nitride epoxy resin system for high performance bonding, sealing, coating and potting featuring remarkably high thermal conductivity and excellent electrical insulation properties. The low weight of this thermally conductive epoxy system is particularly desirable for aerospace and defense applications as well as microelectronic assemblies. It is formulated to cure at room temperature or more rapidly at elevated temperatures and has a ten-to-one (10:1) mix ratio by weight. Other attractive properties include superb dimensional stability as well as superior physical strength properties. EP30BN is a medium viscosity system with good flow characteristics, making it an ideal thermally conductive bonding, sealing and potting epoxy. EP30BN is also an excellent adhesive/sealant forming durable, rigid bonds that are resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the wide temperature range of -60°F to 300°F. The coefficient of thermal expansion is desirably low. The color of part A is gray and part B is clear. Master Bond EP30BN is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where electrical insulation and environmental protection are required and maximum heat transfer must be maintained. The low weight of this thermally conductive epoxy compound is especially attractive for weight sensitive aerospace and defense applications as well as micro-electronic assemblies for enhancing heat dissipation characteristics.